A chip carrier (5) having a plurality of first ends (21--21) is aligned with and bonded to mating lands (34--34) on a PCB substrate (31) by positioning the carrier in a recess of a nozzle (66) on the tool and directing individual streams of hot gas horizontally onto the terminals and lands to cause previously deposited solder thereon to reflow to bond the articles together. Alternatively, articles bonded with reflowable material may be de-bonded in a like manner.

Methods and apparatus for bonding an article to a metallized substrate

A cornea laser-cutting apparatus adapted for use in cutting out a cornea of patient's or donor's eye in full thickness cornea transplanting surgery or keratoplasty. The cornea laser-cutting apparatus comprises an HF or Er-YAG laser source and a projection optical system for converging laser beams radiated from the laser source in a ring-like shape on the cornea, and includes an axicon lens or mirror movably mounted for varying the size of the ring-like shape.

Cornea laser-cutting apparatus

A semiconductor body heater is provided with a planar array of radiant heating elements spaced from a reflector. In the preferred embodiment, each radiant heating element comprises a tungsten filament quartz lamp. Each lamp is removable and replaceable without disengaging any other lamp. The reflector is cooled by flows of gas and liquid coolant therethrough. Flows of gas between the planar array of lamps and the reflector and between the reflector and a cover member also cool the apparatus. Various diffusers for substantially eliminating temperature nonuniformities over an area illumined by the planar array of lamps are also disclosed. The semiconductor body heater of the present invention is particularly well suited for use in a temperature gradient zone melting process.

Semiconductor body heater

The present invention relates to an apparatus and method for patterning areas of a radiation absorbent film material. In the preferred embodiment, the film material is at least partially electrically conductive. The radiation is focused onto the film by a lenticular lens having a plurality of optically active elements to provide a radiation pattern on the film and remove or displace portions of the film to form a corresponding pattern, preferably a conductive pattern. The film may have one or more layers or regions, but at least one region must be radiation absorbent in order to allow the formation of patterns in the film in accordance with the present invention. The areas of the film affected by the phenomenon of radiation absorption are non-conductive voids which may separate the film into a plurality of conductive grid lines whereby the film is useful with a conductive lens film to increase the apparent efficiency of a photovoltaic cell.

Apparatus and method for patterning a film

An optical device for producing a minute beam comprises beam forming means such as laser generator or the like, annular beam forming means such as lens or annular aperture mask for forming the beam from the beam forming means into a beam of annular cross section, and a condenser lens for condensing the annular beam from the annular beam forming means.

Optical device for producing a minute light beam

The bonding of multiple leads on an individual basis is a tedious, time-consuming operation which is often impractical and uneconomical. For example, in bonding individual leads with a beam of radiant energy such as a laser beam, it is frequently impractical and uneconomical to align the lead with a bonding site, align the bonding site and the lead with the beam of radiant energy, apply the laser beam and then repeat the process for each lead to be bonded. As disclosed herein, a beam of radiant energy is shaped into a predetermined pattern so that the beam can be simultaneously applied to a plurality of leads. A composite cylindrical lens is disclosed, for example, which includes a plurality of cylindrical lens segments wherein a line formed by each segment when a collimated beam of radiant energy strikes the composite lens forms a side of a polygon. A perimeter pattern may be formed in this manner which is suitable for simultaneous multiple lead bonding. For example, in simultaneously bonding a plurality of leads extending from a beam leadlike device, the perimeter pattern may have essentially the same configuration as the device so that radiant energy may be applied simultaneously to the leads to be bonded without applying the radiant energy directly to the device itself.

William Alexander Murray

Papers

Simultaneous multiple lead bonding