A microelectronic semiconductor interconnect structure barrier and method of deposition provide improved conductive barrier material properties for high-performance device interconnects. The barrier includes a refractory metal such as cobalt, cobalt-based alloys, ruthenium or ruthenium-based alloys for promoting adhesion of copper. The barrier materials can be deposited by chemical-vapor deposition to achieve good step coverage and a relatively conformal thin film with a good nucleation surface for subsequent metallization such as copper metallization. In one embodiment, the barrier suppresses diffusion of copper into other layers of the device, including the inter-metal dielectric, pre-metal dielectric, and transistor structures.

Microelectronic interconnect material with adhesion promotion layer and fabrication method

Methods and apparatus are provided for uniformly depositing a coating material from a vaporization source onto a powdered substrate material to form a thin coalescence film of the coating material that smoothly replicates the surface microstructure of the substrate material. The coating material is uniformly deposited on the substrate material to form optical interference pigment particles. The thin film enhances the hiding power and color gamut of the substrate material. Physical vapor deposition processes are used for depositing the film on the substrate material. The apparatus and systems employed in forming the coated particles utilize vibrating bed coaters, vibrating conveyor coaters, or coating towers. These allow the powdered substrate material to be uniformly exposed to the coating material vapor during the coating process.

Methods and apparatus for producing enhanced interference pigments

Processes for coating substrates, in particular substrates including shielded surfaces, with transition metal oxide-containing coatings are disclosed. Such processes comprise contacting a substrate with a transition metal oxide precursor, preferably maintaining the precursor coated substrate at conditions to equilibrate the coating, and then oxidizing the precursor to form a substrate containing transition metal oxide. Also disclosed are substrates coated with transition metal oxide-containing coatings for use in various applications.

Transition metal oxide coated substrates

Compositions and methods employing the compositions for attracting arthropods. The compositions comprise at least one compound of formula I and at least one compound from group II.

Chemical composition that attract arthropods

A method for chemical-vapor deposition of a material film adds precursor decomposition by-product to the precursor flow to suppress premature gas-phase precursor decomposition and improve process repeatability and film quality. In one embodiment, CVD cobalt films are deposited with carbonyl precursors with reduced premature gas-phase reaction and particulate generation by the addition of excess carbon monoxide to the process chamber comprising the precursor flow. The addition of carbon monoxide not only suppresses gas-phase reaction but also improves cobalt film purity. The addition of excess carbon monoxide to CVD cobalt precursor flow provides repeatable deposition of glue and nucleation layers to support CVD copper, and is extendable to the deposition of high purity CVD cobalt for other applications and with other precursors, and also extendable for CVD CoSi 2 films and other cobalt-containing applications.

Method of chemical-vapor deposition of a material

In a gas plating process of depositing metal on substrates containing holes, crevices, small voids, cavities, or dead end fissures or bores extending therethrough, the substrate is heated to the decomposition temperature of the thermally decomposable plating gas which is subjected to pulsating pressure conditions in which the pressure is alternately and repetitively reduced and increased, the gaseous decomposition products formed being removed during the pressure reduction. The pulsating pressure conditions are effected either by alternately and repetitively creating a vacuum, or by shutting off and on the flow of gas, or by creating sonic waves in the gas, or by the use of moving walls or diaphragms. In the examples the plating gas is nickel carbonyl, iron carbonyl or aluminium triisobutyl which may be mixed with hydrogen, carbon monoxide, carbon dioxide, nitrogen, methane, helium, argon. The substrates coated may be plaster, carbon coated plaster, brass, copper tubes or balls and ceramic. According to Figure 1 (not shown) the bore (11) of a metal tube is supplied with nickel carbonyl via a conduit (17) hermetically sealed to the bore inlet, the pulsating gas pressure being effected by a solenoid valve (20) or a rotary valve (29). Waste gases are passed to a condenser via outlet (23). In a modification Figure 4 (not shown) the plating chamber (50) is connected with an inlet solenoid valve (56) and an outlet solenoid valve (60) connected to a timing switch (62). According to Figure 5 (not shown) an electrically operated sonic vibrator (80) in dome shaped plating chamber (75) produces the pulsating gas pressure.

Method of depositing metal coatings in holes, tubes, cracks, fissures and the like

Adherent metal coatings of metals that cannot be adherently applied directly onto a desired substrate metal by chemical vapor deposition at a temperature below about 300° C. are obtained by applying an adherent metal undercoating to the surface of the metal substrate which weakly or not at all chemisorbs carbon monoxide, then applying the desired outercoat metal to the undercoat substrate by chemical vapor deposition, using a heat decomposable metal carbonyl as the source of the desired outer coating metal. The undercoating metal may be applied by conventional plating processes such as electroplating or electroless plating. In preferred embodiments, the substrate is iron or steel or their alloys, the undercoating metal is copper, and the outer coating metal is a ferrous metal, i.e., nickel, iron, or cobalt.

Process for coating a metal substrate by chemical vapor deposition using a metal carbonyl

The invention is a procedure and apparatus for coating the individual particles of solid bulk materials, which may be particulate products or multiple small objects, by chemical vapor deposition. The particles or small articles are vigorously agitated and moved along the length of a vibrating, bottom heated, enclosed trough with lesser heated side walls, while the uppermost layer of the moving materials is exposed to the vapor of a volatile heat-decomposable or heat-reactable coating compound.

Deposition metalizing bulk material by chemical vapor

Adherent metal coatings of metals that cannot be adherently applied directly onto a desired substrate metal by chemical vapor deposition at a temperature below about 300° C. are obtained by applying an adherent metal undercoating to the surface of the metal substrate which weakly or not at all chemisorbs carbon monoxide, then applying the desired outercoat metal to the undercoated substrate by chemical vapor deposition, using a heat decomposable metal carbonyl as the source of the desired outer coating metal. The undercoating metal may be applied by conventional plating processes such as electroplating or electroless plating. In preferred embodiments, the substrate is iron or steel or their alloys, the undercoating metal is copper, and the outer coating metal is a ferrous metal, i.e., nickel, iron, or cobalt.

William C. Jenkin

Papers

Method of depositing metal coatings in holes, tubes, cracks, fissures and the like

Process for coating a metal substrate by chemical vapor deposition using a metal carbonyl

Deposition metalizing bulk material by chemical vapor

Method of securing adherent coatings by CVD from metal carbonyls, and articles thus obtained

Method of encapsulation of lithium borohydride