A heat dissipation device includes a primary heat sink ( 10 ) contacting a central processing unit and a secondary heat sink ( 20 ) attached on heat-generating electronic components adjacent the central processing unit. The primary heat sink includes a base ( 12 ) and a heat-dissipation portion ( 14 ) disposed on a middle of the base. The secondary heat sink includes a substrate ( 22 ) and a plurality of fin assemblies ( 24 ) arranged on the substrate. The base is laid on the substrate with the fin assemblies arranged around the heat-dissipation portion. The primary heat sink is partly superposed on the secondary heat sink with a compact structure. The heat-dissipation portion can simultaneously dissipate heat from the central processing unit and its adjacent heat-generating electronic components.

Heat dissipation device

The present invention provides a thermoelectric cooling apparatus for cooling an electronic device such as a CPU, or a computer chip. The apparatus cools the electronic device by two stages. In the first stage, a heat absorbing block collects the heat produced by the electronic device and the apparatus pre-cools the electronic device by dissipating a portion of the collected heat in a distant location through a front heat conductive device and a front radiator. Thereby the heat of the electronic device is reduced to a degree that a TEC can efficiently handle. In the second stage, a TEC of the apparatus dissipate the residual of the heat produced by the electronic device through at least a back heat pipe and a back radiator.

Two stage radiation thermoelectric cooling apparatus

A computer system and its method of cooling are provided. A vapor chamber serves as a heat spreader for heat from the microelectronic die. A thermoelectric module serves to cool the vapor chamber and maintain proper functioning of the vapor chamber, thus keeping the microelectronic die cooled. A controller receives input from five temperature sensors, and utilizes the input to control current to the thermoelectric module and voltage/current to a motor that drives a fan and provides additional cooling. A current sensor allows the controller to monitor and limit power provided to the thermoelectric module.

Computer system having controlled cooling

Disclosed are novel methods and apparatus for provision of efficient, effective, and/or flexible computer system layout and/or cooling configuration. In accordance with an embodiment of the present invention, a method of cooling a computer system is disclosed. The computer system may include a plurality of heat generating electrical components that require cooling. The method includes: providing at least two cooling fans arranged front to back of the computer system to create a push (inlet) and pull (outlet) airflow to cool the computer system and providing a plurality of temperature sensors located at various locations within the computer system to sense a local temperature.

Computer system layout and cooling configuration

A thermoelectric unit for a thermoelectric insulated container. The thermoelectric unit is configured to be inserted in a small opening in the insulated container. A cold side heat sink is mounted on the portion of the thermoelectric unit that extends inside of the insulated container, and a hot side heat sink is mounted on a portion of the thermoelectric unit that extends outside. The thermoelectric unit is arranged so that a thermoelectric module for the thermoelectric unit, the cold side heat sink, and the hot side heat sink are aligned linearly. A hot side fan and motor unit is mounted on the outside of the hot side heat sink and a cold side fan and motor unit is mounted on the outside of the cold side heat sink. The hot and cold side fan and motor units may also be mounted linearly with the hot and cold side heat sinks.

Insulated container with thermoelectric unit

A CPU cooling structure is constructed having a thermoelectric cooling panel installed in a heat sink and controlled by a control circuit to cool the CPU to which the heat sink is fastened.

Wilson Chen

Papers

CPU cooling structure