信人 伊藤

TL;DR: In this paper, the photopolymerization initiator (C) is preferably an oxime-based photopolymersization initiators (C1), particularly an oxIME ester, an aminoacetophenone, an acylphosphine oxide, or a compound having two or more unsaturated groups in a molecule and (E) a thermosetting component.

TL;DR: In this article, a photocurable heat-curable thermocurable resins composition is proposed for printed wiring boards, which enables the formation of a cured coating film having PCT resistance, HAST resistance, electroless gold plating resistance and thermal shock resistance which are important properties required for solder resists for semiconductor packages.

TL;DR: The photo-curable thermosetting resin composition comprises a carboxyl group-containing photosensitive resin having a structure represented by general formula (1) and a photopolymerization initiator, wherein Ris an alkylene oxide group having a (meth)acryloyl group as discussed by the authors.

TL;DR: In this paper, a carboxyl group-containing photosensitive resin was obtained by reacting a compound having two or more cyclic ether groups or cyclic thio-ether groups in one molecule with an unsaturated monocarboxylic acid and further with a polybasic acid anhydride, and reacting the resulting resin with a compound with both of a cyclic e cient group and an ethylenically unsaturated group.

TL;DR: In this paper, a carboxylic acid-containing photo-sensitive resins containing a structure represented by general formula (I), a photopolymerization initiator, and a compound containing two or more ethylenically unsaturated groups in a molecule.