A resin composition of the present invention contains a mixture (A) of at least two of cyanate ester compounds selected from the group consisting of cyanate ester compounds (A1) to (A3) having a specific structural unit, an epoxy resin (B), and an inorganic filler (C). A prepreg of the present invention is obtained by impregnating a base material with the resin composition or applying the resin composition to a base material. Furthermore, a metal foil-clad laminate of the present invention is the laminate comprising the prepreg. Furthermore, a printed wiring board of the present invention contains an insulating layer and a conductor layer formed on a surface of the insulating layer, in which the insulating layer contains the resin composition.

Resin composition, prepreg and laminate

There is provided a resin composition that, despite the fact that the content of an inorganic filler is on approximately the same level as that of the conventional resins, can provide a cured resin product that has a low coefficient of thermal expansion in a plane direction and possesses excellent heat resistance and flame retardance. The resin composition comprises an epoxy resin (A), a maleimide compound (B), a curing agent (C), and an inorganic filler (D), the epoxy resin (A) being represented by formula (I):

Resin composition, prepreg, and laminated sheet

A curable resin composition which can achieve a cured product in which the generation of cracks upon curing is suppressed and which has both a low thermal expansion rate and a low water absorbability is provided The curable resin composition comprises: at least a cyanate ester compound (A) represented by the following formula (I); a metal complex catalyst (B); and an additive (C), wherein the additive (C) contains any one or more selected from the group consisting of a compound represented by the following general formula (II), a compound represented by the following general formula (III), and a tertiary amine

Curable resin composition and cured product thereof

Provided is a novel difunctional cyanate ester of a di-cyanatophenyl type, which can obtain a cured product that is in liquid form at room temperature and has excellent low thermal expansion. A cyanate ester compound represented by formula (I) is disclosed. (In the formula, R1 represents a hydrocarbon group having 2 to 20 carbon atoms.)

Cyanate ester compound, curable resin composition containing cyanate ester compound, and cured product thereof

Provided is a cyanate ester polymer having excellent flame retardance, low dielectric constant, low dielectric loss tangent and high heat resistance. Specifically provided is a cyanate ester polymer obtained by polymerizing a cyanate ester compound represented by the following general formula (1). (1) In the formula, X represents OCN or OH, and 10-100% by mol of X is composed of OCN.

Cyanate ester polymer

PURPOSE: To easily obtain a cyanate compound in high safety, purity and yield by simultaneously adding a t-amine and a cyanogen halide to a specific bisphenol compound, reacting the compounds with each other, washing the product and separating the liquid phases. CONSTITUTION: The objective cyanate compound is produced by adding (A) a t-amine such as triethylamine and (B) a cyanogen halide such as cyanogen chloride at the same time to (C) a bisphenol compound of formula I (A is H or a 1-6C alkyl; X is single bond, a 1-20C organic group, carbonyl, sulfone, S or O; (i) is 0-4) in the presence of a solvent forming separable phases with water such as methyl isobutyl ketone, subjecting the reaction product to the washing with water and the separation into liquid phases to remove the t-amine hydrohalogenic acid salt, contacting the obtained solution (concentrate) with a poor solvent selected from sec-alcohols, t-alcohols and hydrocarbons to cause the crystallization or precipitation and obtain purified product. The compound is useful as a sealing resin for electronic parts or a resin for laminated board, composite material, molded article or adhesive.

Production of cyanate compound

PURPOSE:To obtain an epoxy resin copper clad laminated sheet excellent in heat resistance and low in dielectric constant by using an epoxy resin obtained by reacting an epoxy compd. represented by a specific general formula and a dihydroxy compd. represented by a specific general formula. CONSTITUTION:An epoxy resin is obtained by reacting an epoxy compd. represented by formula I (wherein n is an integer of 1-10, R and R' are a hydrogen atom, a 1-10C alkyl group or the like, one of P and Q is a 4-10C alkyl group and the other one of them is a 1-10 alkyl group and i and j are an integer of 1-4) and a dihydroxy compd. represented by formula II (wherein A is an org. group, X is a 4-10C alkyl group or the like, X' is a 1-3C alkyl group or the like, k is an integer of 1-4, and l is an integer satisfying such a condition that a value of k+l is the number of positions where an aromatic ring contained in A is substitutable). A prepreg obtained by impregnating a base material with a soln. of said epoxy resin and a copper foil are molded under heating to obtain an epoxy resin copper clad laminated sheet.

修一金川

Papers

Production of cyanate compound

Epoxy resin copper clad laminated sheet

修一 金川

Papers

Production of cyanate compound

Epoxy resin copper clad laminated sheet

修一金川