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Yakup Kaya
Researcher at Karabük University
Publications - 22
Citations - 420
Yakup Kaya is an academic researcher from Karabük University. The author has contributed to research in topics: Welding & Explosive material. The author has an hindex of 10, co-authored 20 publications receiving 337 citations.
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Experimental study of diffusion welding/bonding of titanium to copper
TL;DR: In this paper, a Ti-6Al-4V alloy was bonded to electrolytic copper at various temperatures of 875, 890 and 900°C and times of 15, 30 and 60 min through diffusion bonding.
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An investigation into the explosive welding/cladding of Grade A ship steel/AISI 316L austenitic stainless steel
Yakup Kaya,Nizamettin Kahraman +1 more
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The effects of electrode force, welding current and welding time on the resistance spot weldability of pure titanium
Yakup Kaya,Nizamettin Kahraman +1 more
TL;DR: In this article, commercially pure titanium sheets were welded by resistance spot welding at various welding parameters and the welded joints were subjected to tensile-shearing tests in order to determine the strength values.
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Production of wire reinforced composite materials through explosive welding
Behçet Gülenç,Yakup Kaya,Ahmet Durgutlu,I.T. Gülenç,Mehmet Serkan Yildirim,Nizamettin Kahraman +5 more
TL;DR: In this article, aluminum plates were explosively welded by placing a steel wire mesh between them in order to produce wire mesh reinforced composite materials, and the wire mesh was used to improve the mechanical properties of the welded aluminum plates.
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Microstructural, Mechanical and Corrosion Investigations of Ship Steel-Aluminum Bimetal Composites Produced by Explosive Welding
TL;DR: In this article, explosive welding was used in the cladding of aluminum plates to ship steel plates at different explosive ratios, and the influence of the explosive ratio on the cladded bonding interface was examined Optical microscopy, scanning electron microscopy (SEM), and energy dispersive spectrometry (EDS) studies were employed for the characterization of the bonding interface.