Y
Yasu Osako
Researcher at Electro Scientific Industries, Inc.
Publications - 16
Citations - 338
Yasu Osako is an academic researcher from Electro Scientific Industries, Inc.. The author has contributed to research in topics: Laser & Laser beam quality. The author has an hindex of 10, co-authored 16 publications receiving 338 citations.
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Patent
Method for laser singulation of chip scale packages on glass substrates
TL;DR: In this article, an improved method for singulation of compound electronic devices using laser processing has been presented, which provides fewer defects such as cracking or chipping of the substrates while minimizing the width of the kerf and maintaining system throughput.
Patent
Methods and systems for laser processing a workpiece using a plurality of tailored laser pulse shapes
Andy E. Hooper,David Barsic,Kelly J. Bruland,Daragh Finn,Lynn Sheehan,Xiaoyuan Peng,Yasu Osako,Jim Dumestre,William J. Jordens +8 more
TL;DR: In this paper, tailored laser pulse shapes are used for processing workpieces, such as laser dicing of semiconductor device wafers on die-attach film (DAF).
Patent
Multiple laser wavelength and pulse width process drilling
Wei-Sheng Lei,Yunlong Sun,Yasu Osako,John Hillsboro Davignon,Glenn Simenson,Hisashi Matsumoto +5 more
TL;DR: In this paper, dual-beam laser outputs, preferably derived from a single laser beam, improve the quality of the sidewalls of vias drilled in a target material, such as printed circuit board, comprising fiber-reinforced resin.
Patent
Methods and systems for generating pulse trains for material processing
Yasu Osako,Hisashi Matsumoto +1 more
TL;DR: In this article, stable laser pulse trains at high repetition rates are generated from a continuous wave (CW) or quasi-CW laser beams, where one or more laser pulses in the laser pulse train may be shaped to control energy delivered to a target material.
Patent
Method and apparatus for laser singulation of brittle materials
Yasu Osako,Daragh Finn +1 more
TL;DR: An improved method for singulation of electronic substrates into dice uses a laser to first form cuts in the substrate and then chamfers the edges of the cuts by altering the laser parameters as mentioned in this paper.