A method of forming small through-holes in a thin metal layer including the steps of forming resist films having openings formed in accordance with a predetermined pattern; etching one or both sides of the thin metal plate and stopping etching before through-holes are formed; removing the overhang of the resist film by spraying high pressure fluid onto the etched side of the thin metal plate; covering the surface by an etch-resisting layer; forming through-holes by etching the side not covered; and stripping the etch-resisting layer and the resist film.

Method of forming small through-holes in thin metal plate

A shadow mask is formed by forming two photosensitive resin layers respectively on both major surfaces of a band-like metal sheet. The first resin layer is formed by coating a resin solution on the first major surface with the first major surface directed upward, and drying the solution while maintaining the metal sheet horizontal. Likewise, the second resin layer is formed by coating a resin solution of the second major surface with the second major surface directed upward, and drying the solution while maintaining the metal sheet horizontal. Predetermined openings are made in the first and second resin layers by exposing and developing. Then, the bared portions of metal sheet are etched to form apertures therein.

Method for manufacturing a shadow mask

Disclosed is a shadow mask plate material which consists of an Fe-Ni-based alloy containing iron and nickel as main constituents, has an unrecrystallized texture with a grain size of 10 μm or less, and is excellent in etching characteristics for forming electron beam apertures.

Shadow mask plate material and shadow mask

PURPOSE:To manufacture forgings of stable quality at small heat consumption, by cooling a thick cylindrical steel product hot forged by upsetting of extrusion to a specified temperature, performing heat treatment of quenching and tempering starting from the temperature. CONSTITUTION:A thick cylindrical steel product is hot forged by upsetting or extrusion. The forging is once cooled to a temperature range of 390-250 deg.C to disappear substantially coase austenite in the structure, and the whole structure is changed to ferrite, pearlite and bainite. Then, it is heated from 390-250 deg.C to about 850 deg.C and quenched, and tempered at about 590 deg.C. A forging excellent in toughness having microstructure of very fine martensite is obtained. In this case, heating is made from 390-250 deg.C to quenching temperature, heat energy consumption is smaller compared with the case where heating is made from normal temperature to quenching temperature.

Heat treatment of forging

PURPOSE: A composition, obtained by blending crystalline propylene polymer with a specific non melting silicone resin powder and capable of being films having improved transparency and remarkably improved antiblocking property, opening property, slipperiness and external appearance. CONSTITUTION: A composition obtained by blending (A) 100pts.wt. crystalline propylene polymer with (B) 0.01W3pts.wt. nonmelting silicone resin powder having 0.5W7μ average particle diameter. Silicone resin powder having ≥0.8 sphericity (f) expressed by the formula [A is cross-sectional area (mm 2 ) of polymer powder; Dmax is the longest diameter (mm) of the above-mentioned cross section] is used as the component (B). Powder having ≥0.8, preferably ≥0.85 sphericity (f) expressed by the above-mentioned formula is used as the component (A). COPYRIGHT: (C)1987,JPO&Japio

Propylene polymer composition

PURPOSE: To make an opening hole with high accuracy by a method, in which a resist film on one side of raw material for a mask is made thicker than the film on the other side, corresponding to the etching speed and quantity on the large diameter side and the small diameter side respectively, while performing etching process by making the impact force of an etching liquid on the first half film stronger than the second half impact force. CONSTITUTION: A resist film 4 on the roller 8 side is formed thicker than the resist film 4 on the roller 7 side by applying rollers 7 and 8 from both sides while drawing up the raw material 1 for a shadow mask through a photosensitive liquid 4, under such conditions that, for instance, the rollers 7 and 8 are firstly placed symmetrically as shown in dotted line, thereafter, the center of the roller 7 on one side is set up higher by h 1 than the liquid surface, while the center of the other roller 8 is set up lower by h 2 . Thereby, the thickness of the resist films 7 on the larger hole side and on the smaller hole side are preferably, for instance, 5W12μm and 3W6μm respectively. Next, the etching is performed under the condition that the impact force on the resist film may be, for instance, 5W10kg/cm 2 in the first half of etching, while the impact force on the resist film may be 2.5W5kg/cm 2 in the second half of etching. Thereby, an opening hole can be effectively made with high accuracy with no damage to the resist film. COPYRIGHT: (C)1984,JPO&Japio

Yasuhisa Otake

Papers

Manufacture of shadow mask