A connector for optical fibers includes a cylindrical glass ferrule installed in a plastic base member to form a fiber-holding structure This structure includes a small passageway along its central axis for holding an optical fiber, and is mounted within a dielectric housing that includes an opening at one end thereof from which the glass ferrule protrudes A cylindrical spring surrounds the base member and interacts with an interior surface of the housing to urge the glass ferrule outward from the opening in the housing The housing further includes a spring latch which is located on a single side surface thereof, which is manually operable and used to lock the connector to an associated receptacle

Connector for optical fiber

A method is presented for forming a bumped substrate and for forming an electrical circuit which includes the bumped substrate. The method of forming the bumped substrate includes forming at least one electrically conductive polymer bump on each of a first set of bond pads of the substrate. At least one electrically conductive polymer bump is then formed on each of a second set of the bond pads of the substrate. The circuit is formed by selectively forming an organic protective layer around the bond pads of a second substrate by laser ablation of an organic protective coating on the second substrate. The electrically conductive polymer bumps on the first and second portions of the bond pads of the first substrate are then contacted with the bond pads of the second substrate, thereby forming the electrical circuit.

Method of forming electrically conductive polymer interconnects on electrical substrates

A flip-chip light emitting diode includes a substrate, an LED chip and a plurality of conductive bumps. The substrate has at least one recess defined in the surface of the substrate, and at least a part of the conductive bumps is embedded the at least one recess. The LED chip is mounted on a surface of the substrate by a flip-chip mounting process. The conductive bumps are sandwiched between the substrate and the LED chip to bond and electrically connect the LED chip to the substrate.

Flip-chip light emitting diode and method for fabricating the same

A semiconductor package and method for manufacturing the same is disclosed. The semiconductor package comprises a semiconductor chip, a circuit board, an electrical connection means, an encapsulation material and a plurality of conductive balls. The semiconductor chip has a first surface and a second surface. A plurality of input and output pads are formed on one of the first and second surfaces. The circuit board comprises a thin film having a first surface and a second surface and being provided with a center hole in which the semiconductor chip is positioned, a plurality of circuit patterns being formed on the first surface of the thin film and including a plurality of bond fingers and ball lands, and a cover coat covering the circuit board except for the bond fingers and the ball lands. The electric connection means electrically connects the input and output pads of the semiconductor chip with the bond fingers of the circuit board. The encapsulation material covers the semiconductor, the electric connection means and a portion of the circuit board. The conductive balls are fusion-welded on the ball lands of the circuit board.

Semiconductor package and method for manufacturing the same

A semiconductor device comprising a semiconductor chip, a wiring substrate, and an adhesive preferably containing electroconductive particles interposed therebetween, a plurality of spacer elements being present on or below the adhesive layer, said spacer elements having almost the same height as surrounding projecting electrodes and at least one shape selected from circles and polygons when viewed from the top, within an area surrounded by the connected electrodes, has a high flexural strength and high reliability and can be used for information cards, and the like.

Semiconductor device having a semiconductor chip electrically connected to a wiring substrate

In an optical semiconductor module having an optical semiconductor chip mounted on a substrate through a plurality of solder bumps each of which has a predetermined height and which is formed by molten solder, each of the bumps is surrounded by a side wall lower than the predetermined height of each bump. The optical semiconductor chip is precisely positioned on the substrate not only in a horizontal direction by self-alignment effect of the molten solder but also in a vertical direction due to shrinkage of the molten solder with a bottom surface of the optical semiconductor chip kept contact with upper surface of the side walls, upon cooling the molten solder.

Method of manufacturing a compact optical semiconductor module capable of being readily assembled with a high precision

An optical module comprises a capillary in which first and second optical fibers are connected The first optical fiber is aligned through a lens to an optical device, and the second optical fiber functions as a pigtail cord connected to an external optical fiber The first optical fiber is a TEC (thermal expand core) fiber having an end portion whose core diameter is larger than that of the other portion thereof, and the first optical fiber is a normal optical fiber which has a uniform core diameter smaller than the core diameter of the TEC fiber

Optical module, method for fabricating the same and optical module unit with the same

In an optical semiconductor module having an optical semiconductor chip mounted on a substrate through a plurality of solder bumps each of which has a predetermined height and which is formed by molten solder, each of the bumps is surrounded by a side wall lower than the predetermined height of each bump The optical semiconductor chip is precisely positioned on the substrate not only in a horizontal direction by self-alignment effect of the molten solder but also in a vertical direction due to shrinkage of the molten solder with a bottom surface of the optical semiconductor chip kept in contact with an upper surface of the side walls, upon cooling the molten solder

Compact optical semiconductor module capable of being readily assembled with a high precision

Optical fiber connector comprises a ferrule receiving an optical fiber and a sleeve member for holding the ferrule. The body of the ferrule is made of glass on which a thin layer is deposited for reinforcement of the body. The thin layer may be made by hydrolysis, chemical vapor deposition, spray coating etc. The ferrule of the optical fiber connector is inexpensive, easy to assemble and suitable for mass production.

Optical fiber connector having a glass ferrule covered by a thin reinforcing layer

In an optical device comprising a substrate and a package for receiving the substrate on a bottom surface of the package, a block is fixed to an upper surface of the substrate by a low melting-point glass or a solder. The block is made of a welding material and welded to a predetermined part on a wall surface of the package. The substrate has at least one photoelectric element or optical waveguide on the upper surface. An optical fiber is fixed to the package and optically coupled to the photoelectric element or the optical waveguide through a first perforation of the package. The block may be welded to the wall surface of the package made of a welding material. The substrate may have an internal surface which defines a second perforation exposing a predetermined area of the bottom surface. The block is brought into contact with the second internal surface and the predetermined area and welded to the predetermined area.

Yasuhisa Tanisawa

Papers

Method of manufacturing a compact optical semiconductor module capable of being readily assembled with a high precision

Optical module, method for fabricating the same and optical module unit with the same

Compact optical semiconductor module capable of being readily assembled with a high precision

Optical fiber connector having a glass ferrule covered by a thin reinforcing layer

Optical device capable of reliably fixing a substrate to a package