A positive resist composition comprising: at least one compound selected from a compound capable of generating an acid represented by the formula (I) as defined herein upon irradiation with actinic rays or radiation and a compound capable of generating an acid represented by the following formula (II) upon irradiation with actinic rays or radiation; and a compound capable of generating an acid represented by the formula (III) as defined herein upon irradiation with actinic rays or radiation.

Positive resist composition and pattern-forming method using the same

A radiation sensitive resin composition comprising (A) a fluorine-containing copolymer of hexafluoropropylene, at least one compound selected from the group consisting of unsaturated carboxylic acids and unsaturated carboxylic anhydrides, and an unsaturated compound (B) an acid generating compound which generates an acid upon exposure to radiation; (C) a cross-linkable compound; and (D) an organic solvent. The composition suitable is useful for a negative resist for forming a mask for the production of a circuit such as a semiconductor integrated circuit or a thin film transistor circuit for liquid crystal displays as well as a material for forming a permanent film such as an interlaminar insulating film or a color filter protective film.

Radiation-sensitive resin composition

A positive photosensitive composition comprises a compound capable of generating a specified sulfonic acid upon irradiation with one of an actinic ray and radiation and (B) a resin capable of decomposing under the action of an acid to increase the solubility in an alkali developer.

Positive photosensitive composition

Provided is a positive photoresist composition for use in the production of a semiconductor device, which ensures high resolution, reduced edge roughness of a line pattern and a small number of development defects. The positive photoresist composition comprises a resin having a specific silicon-containing group on the side chain, the solubility of which resin in an alkali developer increases under the action of an acid.

Positive photoresist composition

A positive-type photoresist composition comprising an 
alkali-soluble resin, a sensitizer having an 
orthoquinone-diazido group and a solvent, which solvent 
comprises a diester of glycol, having not more than 10 carbon 
atoms in total, of formula (I): 
R¹COOCHR²(CH₂) n CHR³OOCR⁴      (I) 
wherein R¹, R², R³ and R⁴, which may be identical or different, 
each represents a hydrogen atom, a methyl group or an ethyl 
group, and n is 0, 1 or 2.

Positive-type photoresist composition

A positive type photosensitive resin composition com­
prises a mixture of 100 parts by weight of an alkalisoluble 
resin and from 5 to 100 parts by weight of (I) at least one 
1,2-quinonediazidesulfonic acid ester of a natural coloring 
matter selected from α-pyrone compounds having hydroxyl 
groups, γ-pyrone compounds having hydroxyl groups, diaz­
ine compounds having hydroxyl groups and quinone com­
pounds having hydroxyl groups, (II) at least one 1,2-quin­
onediazidesulfonic acid ester of a hydroxybenzoate com­
pound, or a combination of (I) and (II). This positive type 
photosensitive resin composition has a high sensitivity, a 
high resolution and a high yield of residual film thickness and 
also has excellent developability and is well suited for use as 
a high-resistant photoresist for making integrated circuits.

Positive type photosensitive resin composition

A radiation-sensitive resin composition comprising a solution of an alkali-soluble resin and a radiation-sensitive compound in a solvent comprising a monooxymonocarboxylic acid ester. This composition has a high storage stability (i.e., a very small amount of fine particles are formed during storage) and is suited for use as a resist for making integrated circuits.

Radiation-sensitive composition containing 1,2-quinonediazide compound, alkali-soluble resin and monooxymonocarboxylic acid ester solvent

A positive type radiation-sensitive resin composition which comprises a 1,2-quinonediazide compound and an alkali-soluble novolac resin produced by poly-condensing phenols represented by the formulas (I) and (II) in a molar ratio of (I)/(II) of 1/99 to 100/0 with a carbonyl compound: ##STR1## wherein R1 and R2, which may be the same or different, represent hydroxyl groups, hydrogen atoms, alkyl groups, aryl groups, aralkyl groups, alkenyl groups, halogen atoms, alkoxy groups, alkoxycarbonyl groups, aroxycarbonyl groups, alkanoyloxy groups, aroyloxy groups, acyl groups, cyano groups or nitro groups, ##STR2## wherein R3, R4 and R5, which may be the same or different, represent hydrogen atoms, alkyl groups, aryl groups, aralkyl groups, alkenyl groups, halogen atoms, alkoxy groups, alkoxycarbonyl groups, aroxycarbonyl groups, alkanoyloxy groups, aroyloxy groups, acyl groups, cyano groups or nitro groups. The above positive type radiation-sensitive resin composition is excellent in dry-etching resistance, resolution and heat resistance, and appropriate as a positive type resist for producing integrated circuits in which a resist pattern is formed, and also as a positive type resist for producing a mask.

Positive type radiation-sensitive resin composition

1,2-quinonediazide containing radiation-sensitive resin composition utilizing methyl 2-hydroxypropionate, ethyl 2-hydroxypropionate or methyl 3-methoxypropionate as the solvent

A radiation-sensitive resin composition comprising a solution of an alkali-soluble resin and a radiation-sensitive compound in a solvent comprising a monooxymono-carboxylic acid ester. This composition has a high storage stability (i.e., a very small amount of fine particles are formed during storage) and is suited for use as a resist for making integrated circuits.

Yoshihiro Hosaka

Papers

Positive type photosensitive resin composition

Radiation-sensitive composition containing 1,2-quinonediazide compound, alkali-soluble resin and monooxymonocarboxylic acid ester solvent

Positive type radiation-sensitive resin composition

1,2-quinonediazide containing radiation-sensitive resin composition utilizing methyl 2-hydroxypropionate, ethyl 2-hydroxypropionate or methyl 3-methoxypropionate as the solvent

Radiation-sensitive resin composition utilizing monooxymonocarboxylic acid ester solvent