A coil component includes: an insulating resin layer provided between a first planar spiral conductor formed on a back surface of a first substrate and a second planer spiral conductor formed on a back surface of a second substrate; an upper core covering a third second planer spiral conductor formed on a front surface of the first substrate on which the insulating resin layer is formed; and a lower core covering a fourth planer spiral conductor formed on a front surface of the second substrate on which the insulating resin layer is formed. One of the upper and lower cores is formed of a metal-magnetic-powder-containing resin. The coil component includes connecting portions disposed respectively at center and outside portions of each of the first and second substrates so as to physically connect the upper and lower cores.

Coil component and method for producing same

Chip electronic component and manufacturing method thereof disclosed. An example aspect provides a chip electronic component. The chip electronic component includes a magnetic body including a magnetic material, a coil part embedded in the magnetic body and formed to be connected to a first coil conductor and a second coil conductor, an insulating layer covering the first coil conductor and the second coil conductor, and a magnetic layer formed on the insulating layer.

Chip electronic component and manufacturing method thereof

A wireless charging coil is provided herein. The wireless charging coil comprising a first stamped coil having a first spiral trace, the first spiral trace defining a first space between windings, and a second stamped coil having a second spiral trace, the second spiral trace defining a second space between windings, wherein the first stamped coil and second stamped coil are planar to and interconnected with one another, such that the first stamped coil is positioned within the second space of the second stamped coil, and the second stamped coil is positioned within the first space of the first stamped coil.

Wireless Charging Coil

The present invention relates to a common mode filter and a method of manufacturing the same. In order to implement a common mode filter with low shrinkage, high substrate sintered density, and high strength, the present invention provides a common mode filter including: a lower substrate; an insulating layer having a conductor pattern inside and provided on the lower substrate; an upper substrate provided on the insulating layer; and a ferrite core made of ferrite and provided in the center of the insulating layer, the lower substrate, and the upper substrate by penetrating the insulating layer, the lower substrate, and the upper substrate, and a method of manufacturing the same.

Common mode filter and method of manufacturing the same

In a planar coil element and a method for producing the same, a metal magnetic powder-containing resin containing an oblate or needle-like first metal magnetic powder contains a second metal magnetic powder having an average particle size (1 μm) smaller than that (32 μm) of the first metal magnetic powder, which significantly reduces the viscosity of the metal magnetic powder-containing resin. Therefore, the metal magnetic powder-containing resin is easy to handle when applied to enclose a coil unit, which makes it easy to produce the planar coil element.

Planar coil element and method for producing the same

In a planar coil element, the quantitative ratio of inclined particles to total particles of a first metal magnetic powder contained in a metal magnetic powder-containing resin provided in a through hole of a coil unit is higher than the quantitative ratio of inclined particles to total particles of the first metal magnetic powder contained in the metal magnetic powder-containing resin provided in other than the through hole, and many of particles of the first metal magnetic powder in the magnetic core are inclined particles whose major axes are inclined with respect to the thickness direction and the planar direction of a substrate. Therefore, the planar coil element has improved strength as compared to a planar coil element shown in FIG. 9A and has improved magnetic permeability as compared to a planar coil element shown in FIG. 9B.

Planar coil element

PROBLEM TO BE SOLVED: To prevent the increase of the most outer periphery of a plane surface spiral conductor, and also to secure the areas of external electrodes.SOLUTION: A coil component 1 includes: a substrate 2; a plane surface spiral conductor 10a formed on a front surface 2t of the substrate 2 by electrolytic plating; a lead-out conductor 11a connected to the outer peripheral end of the plane surface spiral conductor 10a; a dummy lead-out conductor 15a that is formed between the most outer periphery of the plane surface spiral conductor 10a and an end part 2Xof the substrate 2 within the front surface of the substrate 2 and is not connected to other conductors at least within the same plane; external electrodes 26a, 26b arranged in parallel with the front surface of the substrate 2; and a bump electrode 25b formed on the front surface of the lead-out conductor 11a by electrolytic plating, and connecting the lead-out conductor 11a to the external electrode 26b. The areas of the external electrodes 26a, 26b are larger than those of the bump electrodes 25a, 25b to thereby secure bonding strength in surface mounting.

Coil component and manufacturing method therefor

PROBLEM TO BE SOLVED: To prevent the outmost periphery of a flat surface spiral conductor from exposing on a side surface of a coil component.SOLUTION: A coil component 1 includes: a substrate 2; a flat surface spiral conductor 10a formed on a front surface 2t of the substrate 2 by electrolytic plating; and a flat surface conductor 15a which is formed between the outermost periphery of the flat surface spiral conductor 10a and an end part of the substrate 2, from among the front surface 2t of the substrate 2, and is not connected with other conductors on at least the same plane. The flat surface conductor 15a inhibits a plating layer of the outermost periphery from growing in the lateral direction. Thus, the structure prevents the outmost periphery of the flat surface spiral conductor from exposing on a side surface of the coil component.

Coil component and manufacturing method of the same

PROBLEM TO BE SOLVED: To manufacture a small-sized, thin-type and high-performance coil component in which a DC superposition property is improved and it is not necessary to form a magnetic gap.SOLUTION: A manufacturing method of a coil component includes the steps for forming spiral conductors 12 and 13 on a principal surface of an insulation substrate 11, forming an upper core 15 and a lower core 16, respectively, covering one and the other principal surfaces of the insulation substrate 11 and dicing the insulation substrate 11 together with the upper core 15 and the lower core 16. The step for forming the upper core 15 includes a step for forming connecting parts 11h and 15a-15d which are individually disposed in the center and four corners of a rectangular area on the insulation substrate 11 including the spiral conductors 12 and 13 and physically connect the upper core 15 and the lower core 16. The step for forming the connecting parts includes a step for burying a metal magnetic powder containing resin within an opening pattern formed outside of the center of the rectangular area and positions where the spiral conductors are formed, and then dicing the metal magnetic powder containing resin together with the insulation substrate 11.

Yoshihiro Maeda

Papers

Coil component and method for producing same

Planar coil element

Coil component and manufacturing method therefor

Coil component and manufacturing method of the same

Manufacturing method of coil component