[Problem] To provide a composition for forming a resist underlayer film which is provided with heat resistance suitable for use in a lithography process in the production of semiconductor devices. [Solution] A composition for forming a resist underlayer film, which contains a polymer that contains a unit structure represented by formula (1) and a unit structure represented by formula (2) at a molar ratio of the unit structure represented by formula (1) to the unit structure represented by formula (2) of 3-97:97-3. A method for manufacturing a semiconductor device, which comprises: a step for forming an underlayer film on a semiconductor substrate using the composition for forming a resist underlayer film; a step for forming a hard mask on the underlayer film; a step for forming a resist film on the hard mask; a step for forming a patterned resist film by irradiation of light or electron beam and development; a step for etching the hard mask in accordance with the patterned resist film; a step for etching the underlayer film in accordance with the patterned hard mask; and a step for processing the semiconductor substrate in accordance with the patterned underlayer film.

Composition for forming resist underlayer film containing hydroxyl group-containing carbazole novolac resin

PROBLEM TO BE SOLVED: To provide an epoxy resin that exhibits excellent high heat resistance and moisture resistance and gives a cured product exhibiting excellent flame retardancy and high adhesion to a material of a different kind, and also provide a resin having a carbazole skeleton that acts as an intermediate thereof. SOLUTION: The resin having a carbazole skeleton is represented by formula (1) below and is obtained by causing 10-90 moles of a crosslinking agent such as an aldehyde or xylylene glycol to react with 100 moles of the total of carbazoles and phenols. The epoxy resin having a carbazole skeleton is obtained by epoxidizing the resin having a carbazole skeleton with epichlorohydrin. Formula (1) is represented by H-L-(X-L) n -H, where L is a bivalent group derived from carbazoles and phenols with an abundance ratio (by mole) within the range from 5:95 to 95:5; X is a bivalent group derived from the crosslinking agent such as aldehyde, ketone, xylylene glycol or divinylbenzene; and n is a numerical value of 1-10. COPYRIGHT: (C)2008,JPO&INPIT

Resin having carbazole skeleton, epoxy resin having carbazole skeleton, epoxy resin composition and cured product thereof

PURPOSE:To obtain an arom. resin excellent in heat resistance and curability by reacting carbazole with a dihydroxymethylbenzene or dihalomethylbenzene compd. as a cross-linker. CONSTITUTION:100 mol of carbazole is reacted with 50-300 mol of at least one cross-linker selected from the group consisting of a dihydroxymethylbenzene compd. and a dihalomethylbenzene compd. to give an arom. resin having structural units of formula I (wherein Bn is a group of formula II; and (m) is 0 or 1). The reaction is conducted in the prezence of a protonic acid such as an org. sulfonic acid, sulfuric acid, oxalic acid, or hydrochloric acid at 90-200 deg.C, pref. in the presence of a solvent such as methyl isobutyl ketone to facilitate the progress of the reacton. The obtd. resin softens at 50-150 deg.C and is thermally curable in the presence of a cure accelerator.

Yoshikatsu Isayama

Papers

Aromatic resin and its production