Golf balls comprising thermoplastic, thermoset, castable, or millable elastomer compositions are presently disclosed. These elastomer compositions comprise reaction products of polyisocyanates and telechelic polymers having isocyanate-reactive end-groups such as hydroxyl groups and/or amine groups. These elastomer compositions can be used in any one or more portions of the golf balls, such as inner center, core, inner core layer, intermediate core layer, outer core layer, intermediate layer, cover, inner cover layer, intermediate cover layer, and/or outer cover layer.

Compositions for golf equipment

The oxygen absorptive resin composition of the present invention includes: a thermoplastic resin (a) having carbon-carbon double bonds; a gas barrier resin (b) having an oxygen transmission rate of 500 ml·20 μm/m2·day·atm or less (20° C 65% RH); and a transition metal salt (c) This resin composition and molded articles formed using the resin composition effectively absorb and scavenge oxygen when used to package products susceptible to degradation by oxygen, such as foods and drinks

Oxygen absorptive resin composition

The present invention is an improvement in the preparation of liquid hydrocarbons from natural gas/methane, oxygen and/or steam. In particular, the present invention relates to processes for the production of synthesis gas, reducing the oxygen concentration from the synthesis gas, and the production of liquid hydrocarbons using the oxygen reduced synthesis gas as a feedstock. More particularly, the present invention described herein identifies catalyst compositions, apparatus and methods of using such catalysts and apparatus for preparing liquid hydrocarbons via oxygen reduced synthesis gas all in accordance with the present invention.

Selective removal of oxygen from syngas

Pharmaceutical kits are provided that reduce or prevent oxidative degradation of oxygen-sensitive pharmaceutically active ingredients in solid unit dosage forms that are supplied in oxygen permeable containers. Stabilization of the active ingredient is accomplished by incorporating an oxygen absorber into a sealed oxygen permeable container.

Pharmaceutical kit for oxygen-sensitive drugs

The present invention provides an oxygen-absorbing resin composition containing a thermoplastic resin (A) having carbon-carbon double bonds substantially only in the main chain and a transition metal salt (B), and the oxygen absorption amount of 1 mol of carbon-carbon double bond of the thermoplastic resin (A) being 1.6 mols or more.

Oxygen-absorbing resin composition

Provided is a resin composition which enables the formation of a roughened surface having a low roughness degree on the surface of an insulation layer in a printed wiring board material when used on the insulation layer regardless of the roughening conditions employed and also enables the formation of a conductive layer having excellent adhesion properties, heat resistance, heat resistance under absorption of moisture, thermal expansion properties and chemical resistance on the roughened surface. A resin composition comprising (A) an inorganic filler that is soluble in an acid, (B) a cyanic acid ester compound and (C) an epoxy resin.

Resin composition for printed wiring boards

A resin composition forms a roughened surface with low roughness on an insulating layer regardless of roughening conditions when used as an insulating layer of a printed wiring board, and is excellent in adhesion between the insulating layer and a plated conductor layer, and also has low thermal expansion coefficient (linear expansion coefficient) and high glass transition temperature and is also excellent in moist heat resistance. The resin composition includes an epoxy compound, a cyanate ester compound and an inorganic filler, wherein the cyanate ester compound is at least selected from a naphthol aralkyl type cyanate ester compound, an aromatic hydrocarbon formaldehyde type cyanate ester compound, a biphenyl aralkyl type cyanate ester compound and a novolak type cyanate ester compound; and the content of the epoxy compound is 60 to 75% by weight based on the total amount of the epoxy compound and the cyanate ester compound.

Resin composition for printed wiring board material, and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using same

Provided are: a resin composition which enables the production of a laminated sheet, a printed wiring board and the like each having high heat conductivity and good moldability and rarely undergoing cracking or void formation in a simple manner and with good reproducibility; and a prepreg, a laminated sheet, a laminated sheet cladded with a metal foil and the like, each of which is produced using the resin composition. The resin composition according to the present invention comprises at least a cyanic acid ester compound (A), an epoxy resin (B), a first inorganic filler (C) and a second filler (D), wherein the ratio of the average particle diameter of the first inorganic filler (C) to the average particle diameter of the second inorganic filler (D) is 1:0.02 to 1:0.2.

Resin composition, and prepreg and laminated sheet each produced using same

This resin composition contains (A) a cyanic acid ester compound that is obtained by cyanating a modified naphthalene formaldehyde resin and (B) an epoxy resin.

Resin composition, prepreg, resin sheet and metal foil-clad laminate

A resin composition capable of achieving a printed wiring board or the like excellent in heat dissipation properties, water absorption properties, copper foil peel strength, and heat resistance after moisture absorption is provided. A prepreg, a laminate, a metal foil clad laminate, a printed wiring board and the like, which use the resin composition are also provided. The resin composition of the present invention having at least an epoxy resin, a cyanate ester compound, and an inorganic filler, wherein the inorganic filler includes at least a surface-treated silicon carbide of a silicon carbide powder having at least a part of the surface treated with an inorganic oxide.

Yoshinori Mabuchi

Papers

Resin composition for printed wiring boards

Resin composition for printed wiring board material, and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using same

Resin composition, and prepreg and laminated sheet each produced using same

Resin composition, prepreg, resin sheet and metal foil-clad laminate

Resin composition, prepreg, metal foil-clad laminate and printed wiring board