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Yosuke Okamoto

Researcher at Toshiba

Publications -  37
Citations -  95

Yosuke Okamoto is an academic researcher from Toshiba. The author has contributed to research in topics: Substrate (printing) & Distortion. The author has an hindex of 5, co-authored 37 publications receiving 95 citations. Previous affiliations of Yosuke Okamoto include Toyota.

Papers
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Patent

Unevenness inspection method, method for manufacturing display panel, and unevenness inspection apparatus

TL;DR: In this article, an unevenness inspection method for inspecting presence of unevenness in a panel material is proposed, which includes: acquiring a plurality of primary images by imaging the panel material under inspection on a variety of levels of condition; creating a composite image by combining the plurality of secondary images with a prescribed weighting; and determining the presence of the unevenness using the composite image, the prescribed weight weighting being determined so that a region having unevenness can be distinguished from the other region.
Patent

Patterning method and template

TL;DR: In this article, a patterning method is proposed to release the template from the cured imprint resist, aligning an alignment mark formed in the non-imprint portion of the template with the transfer pattern of the alignment pattern without causing the alignment mark to contact the imprint resist.
Patent

Moire removing method and manufacturing method of display

TL;DR: In this article, the authors provide a moire removing method, along with a manufacturing method of a display, to acquire an image of high resolution and reduced moire, where the image where the moire has occurred is converted into the signal of frequency axis (step S1).
Patent

Euv exposure apparatus, euv mask, and method of measuring distortion

TL;DR: In this article, an EUV exposure apparatus includes a detection unit which detects a position of a measurement mark formed on the rear surface of the EUV mask, and a control unit which calculates a distortion amount based on the position of the measurement mark and performs exposure control on a wafer while correcting the distortion amount.
Patent

Method for measuring pattern misalignment

TL;DR: In this paper, a method for measuring pattern misalignment is described, which includes: a first step obtaining image data; a second step specifying a measurement region; a third step calculating a first shift amount (x 1, y 1 ); a fourth step determining, after calculating the first shift amounts, a first distribution; a fifth step executing a plurality of times the second step, the third step, and the fourth step; a sixth step determining a second shift amount, a second distribution; and a seventh step determining the second distribution.