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裕二 宗澤

Publications -  10
Citations -  91

裕二 宗澤 is an academic researcher. The author has contributed to research in topics: Polyamide & Chemical resistance. The author has an hindex of 7, co-authored 10 publications receiving 91 citations.

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Patent

Polyamide resin composition and molded article comprising the same

TL;DR: In this article, the polyamide resin composition is produced by kneading a polyamide (I) composed of a dicarboxylic acid unit containing 50-100 mol% terephthalic acid unit and a diamine unit containing 60-100mol% a 6-18C aliphatic diamine units and having a terminal amino group content ([NH 2 ]) of 10 μ-eq/g and less than 60 μ- eq/g, a modified resin (II) modified with an unsaturated compound having a carboxyl group and/or
Patent

Continuous fiber reinforced semi-aromatic polyamide resin composition

TL;DR: In this paper, the continuous fiber reinforced semi-aromatic polyamide resin composition includes 100 parts by mass of a polyamide, comprising a dicarboxylic acid unit (a) comprising a terephtalic acid unit and a diamin unit (b) having 50-100 mol% of a 1,9-nonanediamine unit and/or a 2-methyl-1,8-octanediamines unit, and 5-300 parts of a fibrous reinforcing material (B) having a fiber length of 3 mm or longer.
Patent

Polyamide resin composition and molded article of the same

TL;DR: In this paper, a polyamide resin composition comprising a dicarboxylic acid unit (a) containing 50 to 100 mol% of terephthalic acid units, 1,9-nonanediamine units and / or 2-methyl-1,8-octanediamines units.
Patent

Polyamide resin composition and molding comprising the same

TL;DR: In this article, the authors proposed a polyamide resin composition that has extremely excellent impact resistance and durability, low water absorption properties and excellent properties such as heat resistance, sliding properties, chemical resistance, etc.
Patent

Method for producing polyamide composition, polyamide composition, and molded article composed of polyamide composition

TL;DR: In this article, a method for producing a polyamide composition includes a process for melting and kneading polyamide (I), a modified resin (II) modified by an unsaturated compound having a carboxy group and/or an acid anhydride group, and nigrosine or its derivative (III).