An interconnect element is provided. A monolithic dielectric element has a first exposed major surface, a plurality of first recesses extending inwardly from the first major surface, and a second exposed major surface remote from the first major surface, a plurality of second recesses extending inwardly from the second major surface. A plurality of first metal interconnect patterns are embedded in the plurality of first recesses and extend in one or more directions along the first major surface. A plurality of second metal interconnect patterns are embedded in the plurality of second recesses and extend in one or more directions along the second major surface. A plurality of non-hollow metal posts extend through the dielectric element between at least some of the plurality of first metal interconnect patterns and at least some of the plurality of second metal interconnect patterns.

Structure and method of making interconnect element having metal traces embedded in surface of dielectric

A wiring pattern forming method in which side etch of a wiring pattern at the time of etching the substrate copper foil of a copper plating pattern is reduced to hold down an increase in line resistance, the wiring pattern forming method including the steps of: providing a plating resist pattern of which open area comprises a wiring pattern on the surface of a copper-clad laminate which is obtained by providing a copper foil on an insulating substrate; plating such open area with copper to form a copper plating pattern; then plating a crevice between the copper plating pattern and the plating resist pattern with a solder film by alternately repeating application of a current for a predetermined time period and suspension of the current application for a predetermined time period; and etching away the copper foil by using the solder film as an etching resist to form the wiring pattern.

Method for forming wiring pattern

PURPOSE: To enable a multilayer ceramic chip inductor to be enhanced in reliability and lessened in cost by a method wherein the ceramic chip inductor is enhanced in impedance and lessened in conductor resistance and number of layers, where a large number of the ceramic chip inductors are used as noise-reducing parts in a high-mounting density circuit with the reduction of a digital equipment in size and thickness. CONSTITUTION: Coiled plating conductors 2 and 5 formed through an electrocasting method are transferred onto a sheet-like magnetic layers 1 and 6 respectively and electrically connected together through the intermediary of a through-hole 4 provided to a sheet-like magnetic layer 3, whereby a multilayer ceramic chip inductor lessened in number of layers, enhanced in impedance, and decreased in conductor resistance can be realized. COPYRIGHT: (C)1996,JPO

Multilayer ceramic chip inductor and manufacture thereof

The present invention relates to a high density circuit board for increasing the density of a circuit by impregnating fine circuit patterns inside a top part of a substrate, and a method for manufacturing the same. In accordance with the present invention, a high density circuit board includes a substrate with fine circuit patterns impregnated inside top and bottom parts; a via formed inside the substrate to electrically conduct the fine circuit patterns of the top and bottom parts of the substrate each other; pads formed on the fine circuit patterns of the top part of the substrate; and solder resists formed on the top and bottom parts of the substrate, which can convert the circuit patterns into fine pitches and increase the degree of close adhesion between the substrate and the circuit patterns, thereby improving reliability.

High density circuit board and manufacturing method thereof

A circuit board is disclosed In addition to insulating layers, the circuit board includes a structure for heat transfer that includes a first layer that is formed of graphite or graphene, a second layer that is formed of metallic material and disposed on one surface of the first layer, and a third layer that is formed of metallic material and disposed on the other surface of the first layer, and at least a portion of the structure for heat transfer is inserted into an insulation layer Such a circuit board provides improved heat management Also disclosed is a method of manufacturing the circuit board

Circuit board and manufacturing method thereof

PURPOSE:To eliminate troubles caused by the dispersion of solder in thickness by a method wherein a metal thin film is formed in a common state on the surface where a solder connecting section is formed CONSTITUTION:A metal thin film 12 is formed on the surface of a platelike conductive base 11, which is subjected to an electrolytic bath using a resist mask 13 to leave only a conductor circuit layer 14 unremoved on the metal thin film 12 Next, the conductor circuit layer 14 is laminated on an insulating base 15 with the thick conductive base 11 into an integral piece, which is pressure-bonded or hot pressure-bonded to transfer the conductor circuit layer 14 to the insulating base 15 side As the metal thin film 12 and the conductor circuit layer 14 are combined together with high adhesive power, so that the conductor circuit layer 14 is prevented from moving to deviate at a transferring process And, the surface of a solder layer 13 formed on a metal plating layer 13 through an electroplating method is smooth and the layer 13 is all uniform in thickness By this setup, problems such as a Manhattan phenomenon and the like caused by the dispersion of a solder layer in thickness can be prevented

Yuji Kawada

Papers

Manufacture of printed wiring board