Micrometer boron nitride/polyamide acid ( m BN/PAA) compound was firstly fabricated via in -situ polymerization, performed to obtain the m BN/PAA electrospun fibers by electrospinning technology, finally to fabricate the dielectric thermally conductive m BN/polyimide ( m BN/PI) composites via thermal-imidization followed by hot press method. The obtained m BN/PI composite with 30 wt% m BN presents relatively highly thermally conductive coefficient ( λ ), excellent dielectric constant ( e ) & dielectric loss tangent (tan  δ ), and extremely outstanding thermal stability, λ of 0.696 W/m K, e of 3.77, tan  δ of 0.007, T Heat-resistance index ( T HRI ) of 279 °C and glass transition temperature ( T g ) of 240 °C, which presents a great potential for packaging in integration and miniaturization of microelectronic devices.

Dielectric thermally conductive boron nitride/polyimide composites with outstanding thermal stabilities via in-situ polymerization-electrospinning-hot press method

Porous lignin based poly (acrylic acid)/organo-montmorillonite nanocomposites: Swelling behaviors and rapid removal of Pb (II) ions

Non-covalently functionalized graphene strengthened poly(vinyl alcohol)

Hybrid fillers of micrometer boron nitride/nanometer boron nitride (mBN/nBN) were employed to fabricate the highly thermally conductive insulating mBN/nBN/polyphenylene sulfide ((mBN/nBN)/PPS) composites via mechanical ball-milling followed by hot-compression method. The thermally conductive coefficient (λ), dielectric constant (e) & dielectric loss tangent (tan δ) values and thermal stabilities were all enhanced with the increasing addition of mBN/nBN hybrid fillers. The λ value was improved from 0.286 W/mK for pristine PPS matrix to 2.638 W/mK for the (mBN/nBN)/PPS composite with 60 wt% mBN/nBN (mass fraction, 2:1) hybrid fillers. Appropriate addition of the mBN/nBN hybrid fillers played a role of heterogeneous nucleation for PPS matrix. Agari model fitting revealed that the mBN/nBN hybrid fillers could be much easier to form the continuous thermally conductive channels & networks. The corresponding e and tan δ values still maintained relatively lower level of 3.96 and 0.022, respectively. And the corresponding THeat-resistance index (THRI) value was beyond 277.8 °C.

Synergistic improvement of thermal conductivities of polyphenylene sulfide composites filled with boron nitride hybrid fillers

Balance the electrical properties and mechanical properties of carbon black filled immiscible polymer blends with a double percolation structure

Parallel carbon nanotube stripes in polymer thin film with tunable microstructures and anisotropic conductive properties Part A Applied science and manufacturing

Yutian Zhu

Papers

Parallel carbon nanotube stripes in polymer thin film with tunable microstructures and anisotropic conductive properties Part A Applied science and manufacturing