The conductive material according to the present invention includes a binder resin and conductive particles each having a solder at a conductive surface, the binder resin includes a curable compound capable of being cured by heating, and a thermal curing agent, and when the binder resin and the solder in the conductive particle are each heated at a temperature rising rate of 10° C/minute to perform differential scanning calorimetry, an exothermic peak top temperature in curing of the binder resin is lower than an endothermic peak top temperature in melting of the solder

Conductive material and connection structure

A composition for forming a transparent resin layer of the present invention includes a polymerization initiator having a molar absorption coefficient (e) at a wavelength of 365 nm of 1000 mol −1 ·L·cm −1 or less; a polymerizable compound; a polymer; and a solvent. The polymerization initiator is preferably at least one selected from the group consisting of an α-hydroxyacetophenone-based compound and a phosphine-based compound.

Composition for forming transparent resin layer, transparent resin layer, solid imaging element and optoelectronics device

The present invention relates to a colored photosensitive resin composition, a color filter and an image display device manufactured using the same The colored photosensitive composition comprises: a photopolymerizable compound having at least one moiety selected from a group consisting of oxyethylene and oxypropylene in the molecular structure and having at least three functionalities of an urethane acrylic structure or a structural analog thereof; a colorant comprising a rhodamine-based dye in a particulate state; and a dispersant comprising a triazine-based compound

Colored photosensitive resin composition color filter and image display device produced using the same

The purpose of this invention is to provide a curable composition without conventional problems, ensuring excellent adhesion strength in short time at low temperature and low pressure, and allowing electrical connection between components. The solution of this invention is the curable composition, characterized by comprising (A) compound having an ethylenically unsaturated bond, (B) peroxide, and (C) solder powder. In addition, the curable composition of this invention is characterized by comprising (A) compound having an ethylenically unsaturated bond, (B) peroxide, (D) organic component composed of organic binder, and (C) conductive powder composition, wherein the organic component (exclusive of solvent when containing solvent) has an ethylenically unsaturated bond equivalent of 260 or greater.

Curable composition and electronic component

The invention discloses a UV-curing transparent insulating ink which comprises the following components in parts by weight: 10-35 parts of epoxy acrylate resin, 30-60 parts of polyurethane acrylate resin, 10-30 parts of reactive diluent, 1-8 parts of photoinitiator and 1-5 parts of assistant. The epoxy acrylate resin is a bifunctional epoxy acrylate resin; the polyurethane acrylate resin is a bifunctional aliphatic polyurethane acrylate resin; the reactive diluent is a monofunctional acrylate monomer-bifunctional acrylate monomer mixture; the photoinitiator is a 1-hydroxycyclohexylphenyl ketone-2,4,6-trimethylbenzoyldiphenyl phosphine oxide mixture; and the assistant comprises a coupling agent, a defoaming agent, a leveling agent and a thickener. The invention also discloses a preparation method of the UV-curing transparent insulating ink. The UV-curing transparent insulating ink has the advantages of low cost, high transparency, high adhesive force, favorable insulativity and the like.

UV-curing transparent insulating ink, and preparation method and application thereof

PROBLEM TO BE SOLVED: To provide an anisotropic conductive paste having sufficient adhesion strength, insulating property and moisture resistance even when the temperature upon thermal compression bonding is low (for example, at 180°C or lower).SOLUTION: The anisotropic conductive paste comprises (A) a thermoplastic resin, (B) a (meth)acrylate reactive diluent having one unsaturated double bond in one molecule, (C) a radical polymerization initiator, (D) an activator having one or more carboxyl groups in one molecule, and (E) solder powder. The (D) component is a carboxyl group-containing copolymer prepared by copolymerizing a carboxyl group-containing polymerizable unsaturated compound having one or more carboxyl groups and one or more unsaturated double bonds in one molecule with a polymerizable unsaturated compound having one or more unsaturated double bonds in one molecule. A compounded amount of the (D) component is 5 pts.mass or more and 45 pts.mass or less with respect to 100 pts.mass of the (E) component.

Anisotropic conductive paste and printed wiring board using the same

PROBLEM TO BE SOLVED: To provide a transparent resin composition for forming an insulation film, excellent in adhesiveness to an adhesion resisting base material such as an ITO film or the like without impairing characteristics such as transparency, insulation, bending resistance, coating hardness, and chemical resistance or the like.SOLUTION: A transparent resin composition for forming an insulation film contains (A) urethane (meta) acrylate, (B) bisphenol A type epoxy (meta) acrylate and (C) a reactive diluent containing a carboxy group and (D) a reactive diluent containing one (meta) acrylate and one or more of aromatic ring group, and/or alicyclic group in one molecule, and (E) a photopolymerization initiator. An acid value is 4.0-20 mgKOH/g.

Transparent resin composition for forming insulation film

Provided is a novel curable composition for manufacturing a cured film that has a variety of uses. Said curable composition is characterized by containing: a compound (A) with a molecular weight between 500 and 5000, each molecule of which contains two or more unsaturated groups but does not contain any carboxy groups; a photopolymerization initiator (B); a reactive diluent (C), each molecule of which contains two or more unsaturated groups; and a compound (D), each molecule of which contains at least one amino group or imino group.

禎大三木

Papers

Anisotropic conductive paste and printed wiring board using the same

Transparent resin composition for forming insulation film

Curable composition, cured material therefrom, and use thereof

禎大 三木

Papers

Anisotropic conductive paste and printed wiring board using the same

Transparent resin composition for forming insulation film

Curable composition, cured material therefrom, and use thereof

禎大三木