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IEEE Transactions on Components and Packaging Technologies
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2012
Showing papers in "IEEE Transactions on Components and Packaging Technologies in 2012"
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Journal Article
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High density metal-metal interconnect bonding for 3D integration
[...]
John Lannon
,
Christopher Gregory
,
Matthew Lueck
,
Jason Reed
,
Alan Huffman
,
Dorota Temple
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+2 more
01 Jan
2012
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IEEE Transactions on Components and Packaging Technologies
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