Patent
Circuit board and production of the same
Takeshi Suzuki,Tatsuo Ogawa,Yoshihiro Bessho,Satoru Tomekawa,Yasuhiro Nakatani,Yoji Ueda,Susumu Matsuoka,Daizo Andoh,Fumio Echigo +8 more
TLDR
In this article, a circuit board is configured so as to include not less than two wiring layers, an insulator layer for electric insulation between the wiring layers and an inner-via-hole conductive member provided in the insulator layers in a thickness direction of the insulation layer, for electric connection between the wires layers.Abstract:
A circuit board is configured so as to include not less than two wiring layers, an insulator layer for electric insulation between the wiring layers, and an inner-via-hole conductive member provided in the insulator layer in a thickness direction of the insulator layer, for electric connection between the wiring layers. The insulator layer is made of a composite material containing an organic resin and a material having a smaller thermal expansion coefficient than that of the organic resin, and includes a surface part, a core part, and a surface part laminated in the stated order, the surface part having a high content of the organic resin, the core part having a low content of the organic resin. The wiring layers have a land portion that is connected with the inner-via-hole conductive member, the land portion being embedded so as to be substantially in contact with the core part, and the inner-via-hole conductive member has a thickness substantially equal to a thickness of the core part. According to this configuration, a part of the metal foil is embedded in the insulator layer so as to be in contact with the core layer. Therefore, this makes it possible to provide a circuit board in which portions of the conductive material can be selectively compressed, and which hence is capable of ensuring stable connection between layers.read more
Citations
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Patent
Semiconductor package and method of manufacturing the same
TL;DR: In this paper, a light-emitting device package including a lead frame formed of a metal and on which a light emitting device chip is mounted; and a mold frame coupled to the lead frame by injection molding is presented.
Patent
Circuit substrate and method for fabricating the same
TL;DR: In this paper, a circuit substrate including a silicon substrate with through-holes formed therein, conducting films formed on the inside walls of the through holes, and an organic resin film forming on the surface of at least one side of the silicon substrate and covering at least parts of the holes was presented.
Patent
Insulation sheet and multi-layer wiring substrate and production processes thereof
TL;DR: In this paper, a wiring substrate is produced by laminating such insulation sheets, that have conductive paste in via holes, and subjecting this laminate to thermo-compression bonding, wherein deformation of via holes and dislocation of the via holes because of a molten insulation sheet, does not occur.
Patent
Heat dissipating semiconductor package and fabrication method thereof
Chien-Ping Huang,Chih-Ming Huang +1 more
TL;DR: In this paper, a heat dissipating semiconductor package and a fabrication method thereof are provided, where a semiconductor chip is mounted on a chip carrier, and an insulating core layer, a thin metallic layer formed on each of an upper surface and a lower surface of the core layer and a thermal via hole formed in the inner core layer.
Patent
Method for plating polymer molding material, circuit forming component and method for producing circuit forming component
Hirokazu Tanaka,Hirono Satoshi +1 more
TL;DR: In this paper, the surface of an insulation layer formed by coating a resin coating basic material with a polymer material filled with inorganic filler and diluted with a solvent was irradiated with a laser beam and then depositing the catalyst of electroplating.
References
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Patent
Image formation on objective bodies
Masanori Akada,Yoshikazu Ito,Jumpei Kanto,Mitsuru Takeda,Masaki Kutsukake,Noritaka Egashira,Shunsuke Mukasa,Takao Suzuki,Hideo Hosoi,Yasuo Otatsume +9 more
TL;DR: In this article, an image-transferable sheet acting for image carry-over service and in reliance on sublimation image transfer technique is used to transfer the desired images to the objective body.
Patent
Method of manufacturing a multilayer circuit board
TL;DR: In this article, a plurality of circuit layers are stacked, one on top of the other, one after another, one at a time, in order to fabricate multilayer circuits.
Patent
Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same
TL;DR: A connecting member of circuit substrates includes an organic porous base material provided with tack free films on both sides, through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films.
Patent
Porous substrate and conductive ink filled vias for printed circuits
Akihito Hatakeyama,Hiroshi Sogo,Tamao Kojima,Yasuhiko Horio,Masahide Tsukamoto,Yasushi Fukumura +5 more
TL;DR: In this paper, a method of manufacturing an organic substrate used for printed circuits is described, which includes the steps of forming through-holes in a porous raw material provided with cover films and having compressive shrinkage.
Patent
Hybrid wiring board, semiconductor apparatus, flexible substrate, and fabrication method of hybrid wiring board
TL;DR: In this paper, the authors proposed a wire-and-wire structure that can mount a highly integrated semiconductor device, that is small and thin, and that has high reliability.