PURPOSE:To obtain copper alloy products of a non-precipitation type solid soln. having easy workability, good weldability and solderability by soln. heat treating a copper alloy contg. iron and cobalt of each predetermined amt. at a predetermined temp.

PURPOSE:To efficiently carry out the winding operation of a pipe by providing a moving means for removing a pipe wound up on a winding drum on one side board, a groove for inserting one end of a pipe to be wound on the outer peripheral face of a winding shaft, and a stopping means for stopping one end of said pipe CONSTITUTION:When a conduit pipe P from an extruder is inserted into a groove 25 formed on the winding shaft 22 of a winding drum 20, the cylinder rod 73 of a chuck device 7 pulls up a connecting arm 74 to fix the pipe P with a claw part 71, starting winding Then, the winding drum 20 on which the conduit pipe P is wound up is moved to a binding position, a cut-off conduit pipe P is bound in a defined position and, then, the collapsible side board 23a of the winding drum 20 falls on a pipe bundle removing side via a link mechanism 27 by the action of a cylinder 24 while, at the same time, the claw part 71 of the chuck device 7 is also pulled out, and the pipe bundle of the bound conduit pipe P is pushed out frontward by a push-out cylinder Thereby, the winding operation of a pipe can be efficiently carried out

Copper alloy products and manufacture thereof

Pipe winding drum

PROBLEM TO BE SOLVED: To provide a copper alloy which is suitable for the heat sink of a semiconductor module, and has particularly a high effect of inhibiting the heat sink from deforming when the heat sink is jointed with a substrate through Pb-free solder. SOLUTION: The copper alloy has a composition comprising, by mass, 3-15% Ni, 3% or less B, while controlling the ratio Ni/B to 7 or less, 3% or less of elments other than Cu, Ni and B in total, and the balance Cu; has a Cu matrix in which the concentration of Ni is controlled to 2.5 mass% or lower; and has properties including a heat conductivity of 260 W/m×K or higher, a thermal expansion coefficient of 16.6×10 -6 /K or lower, a 0.2% yield strength of 270 N/mm 2 or higher, and a heat resisting temperature of 270°C or higher. The method for manufacturing the alloy comprises the steps of: cold-rolling the alloy with a reduction rate of 10% or higher; annealing the cold-rolled material in a temperature range of 400 to 900°C, so that the material can cause age precipitation and have the concentration of Ni in the Cu matrix to 2.5 mass% or lower; and subsequently finish-rolling it with a reduction rate of 5 to 40%. COPYRIGHT: (C)2006,JPO&NCIPI

Copper alloy products and manufacture thereof

Citations

Pipe winding drum

Copper alloy, manufacturing method therefor, and heat sink