Patent
Curable epoxy resin compositions containing novel disecondary diamines
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TLDR
In this article, a diepoxy compound containing two 1,2-epoxyethyl residues and a disecondary diamine of the formula is described. But these formulations are not suitable for casting, impregnating or laminating resins or binders, coacting or sealing compositions.Abstract:
Curable epoxy resin mixtures suitable for use as casting, impregnating or laminating resins or binders, coacting or sealing compositions, characterized in that they contain I. a diepoxy compound containing two 1,2-epoxyethyl residues, II. a disecondary diamine of the formularead more
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One component water reduced epoxy adhesives
TL;DR: In this paper, the polyepoxide is reacted with from 50 to 70 wt. % of a polyoxyalkylene monoamine having a molecular weight of from 900 to 2000, in which A is 16-25 and B is 1-5.
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Improvements in or relating to epoxide resin compositions
TL;DR: A resinous composition comprises an epoxide resins containing more than one epoxy group per molecule, a hardener for the epoxide resin and a disecondary amine having the formula R,NH,X, NH,R1 where X is a chain containing at least four atoms, and R and R1 are organic radicals which may be alike or different.