Determination of the individual additive components in acid copper plating baths

Open AccessJournal Article

Determination of the individual additive components in acid copper plating baths

W. O. Freitag, +3 more

- 01 Jan 1983 -

Plating and Surface Finishing

- Vol. 70, Iss: 10, pp 55-60

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This article is published in Plating and Surface Finishing.The article was published on 1983-01-01 and is currently open access. It has received 24 citations till now. The article focuses on the topics: Copper plating & Electroplating.

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Journal ArticleDOI

Additives in the electrocrystallization process

Waldfried Plieth

- 01 Sep 1992 -

Electrochimica Acta

TL;DR: In this paper, the concept of hard and soft acids and bases is discussed in order to understand competitive adsorption, and several methods are in use for in situ control of their activity: cyclic voltammetry and laser light scattering.

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Journal ArticleDOI

Investigation of the effects of byproduct components in Cu plating for advanced interconnect metallization

L. T. Koh, +3 more

- 01 Mar 2002 -

Microelectronics Journal

TL;DR: In this article, the effects of byproduct components generated from a commercially available two components additive package on the copper plating performance for advanced interconnect metallization were discussed, and it was suggested that the increase of incorporated sulfur impurities could render in slower self-annealing rate of the asplated copper film due to the grain boundary pinning effect.

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Journal ArticleDOI

On the Role of Poly(ethylene Glycol) in Deposition of Galvanic Copper Coatings

Dimitar Stoychev

- 01 Jan 1998 -

Transactions of The Institute of Metal F...

TL;DR: A literature review of the influence and behaviour of polyethers of the type of polyethylene glycol and polypropylene glycol on electro deposition of copper coatings in this paper.

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Patent

Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions

Jianwen Han, +4 more

TL;DR: In this article, a real-time analysis of electrochemical deposition (ECD) metal plating solutions is presented for the purpose of reducing plating defects and achieving high quality metal deposition.

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Patent

Method and apparatus for real time monitoring of industrial electrolytes

Kazimierz Wikiel, +3 more

TL;DR: In this paper, the authors present a method for analysis of voltammetric data obtained for various plating baths using various chemometric techniques of modeling power, outlier detection, regression and calibration transfer.

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