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Patent

Electronics cooling using bimetal

TLDR
In this paper, a cooling system with bimetal elements can increase system reliability with a cost reduction by increasing system reliability and reducing the cost of the cooling system, which can increase the fluid flow between two enclaves.
Abstract
An apparatus includes a first enclosure (102) having an interior that is at a first temperature (T1) and a second enclosure (104) having an interior that is at a second temperature (T2). An opening (106) allows fluid to flow between the interior of the first enclosure (102) and the interior of the second enclosure (104). A bimetal valve (108) is positioned in the opening (106) to regulate the fluid flow between the first enclosure (102) and the second enclosure (104) depending on the first temperature (T1) or on the difference between the first temperature (T1) and the second temperature (T2). The apparatus using a cooling system with bimetal elements can increase system reliability with a cost reduction.

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