Patent
Equivalent circuit of package ground terminal paddle
TLDR
In this article, an equivalent circuit of a package ground terminal paddle which is used to mount a microwave integrated circuit is described, which takes the impedance component output from each terminal as one common impedance component and grounds the common impedance.Abstract:
The present invention relates to an equivalent circuit of a package ground terminal paddle which is used to mount a microwave integrated circuit, and more particularly, to an approximate equivalent circuit of the package ground terminal paddle by which the expressions of parasitic components can be easily expanded according to the number of gold wires that are down-bonded to the paddle, by introducing an equivalent circuit structure which takes the impedance component output from each terminal as one common impedance component and grounds the common impedance.read more
Citations
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References
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Patent
Low impedance packaging
TL;DR: In this article, a lead frame with an overlying dielectric layer is described, where one or more conductive coupons are placed on the layer and act as multiple inductive paths for the power and ground lines.
Patent
Power combiner/splitter
TL;DR: In this article, a passive electric power splitter/combiner consisting of a first inductor (117) between an input terminal and a first output terminal, a second inductor between the input node and a second output node, a first capacitor (111) between the first output node and ground node, and a third capacitor (115) between a node node and the ground node is presented.
Patent
Radio frequency switching device
TL;DR: In this article, a radio frequency switching device package with improved isolation is described, where an extra wire bond between the anode of the PIN diode and an extra leadframe is added to the device package.
Patent
Method for modeling interactions in multilayered electronic packaging structures
TL;DR: In this paper, a method for analyzing interactions between signal traces/vias and ground/power planes in multilayered electronic packaging structures is presented, where the structure is provided with at least two, spaced-apart, conductive (generally metallic) planes, a conductive signal trace interposed between and coplanar with the spacedapart conductive planes, and a via connected to the signal trace.
Patent
Semiconductor integrated circuit apparatus having input/output portions impedance-matched for transmission lines
TL;DR: In this paper, the following formula is satisfied: ''QU1'' where Z is an impedance of each of the transmission lines; L1 and L2 are inductances of the two pins; and C1 is a capacitance of each input/output portions.