Patent
High strength composite component and method of fabrication
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TLDR
In this paper, a composite component suitable for high temperature applications which includes a composite compact that is thermally stable at temperatures up to 1200°C, the composite compact including a thin layer of metal bonded directly to a polycrystalline table in a HP/HT press, and a metallic substrate joined to the thin layer by a high strength braze joint.Abstract:
A composite component suitable for high temperature applications which includes a composite compact that is thermally stable at temperatures up to 1200° C., the composite compact including a thin layer of metal bonded directly to a polycrystalline table in a HP/HT press, and a metallic substrate joined to the thin layer of metal by a high strength braze joint. The method of fabrication includes the steps of: placing a high temperature braze filler metal on the upper surface of the substrate and in contact with the thin layer of metal; applying heat through the table to melt the filler metal and accomplish the high strength joint between the substrate and the thin layer of metal; and cooling the substrate by conducting heat from all but the upper surface thereof.read more
Citations
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Thermally stable ultra-hard material compact constructions
TL;DR: In this article, a thermally stable ultra-hard compact constructions of this invention comprise an ultrahard material body that includes an ultra hard region positioned adjacent a surface of the body.
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TL;DR: In this paper, a superabrasive table comprises diamond-silicon carbide composite including diamond grains dispersed through a matrix of silicon carbide grains and a substrate is positioned in proximity to the mixture.
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John Daniel Belnap,Stewart Middlemiss,Anthony Griffo,Thomas W. Oldham,Kumar Thippaiyagowder Kembaiyan +4 more
TL;DR: In this article, a reaction product is formed between a binder/catalyst material and a material reactive with the binder and catalysts, which is disposed within interstitial regions of the polycrystalline diamond material that exists between the bonded diamond crystals.
References
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Patent
Composite abrasive compact having high thermal stability and transverse rupture strength
TL;DR: In this paper, a table of diamond or boron nitride particles with a strong, chemically inert binder matrix and a thin metal layer bonded directly to the table in a HP/HT press is characterized by having high thermal stability at temperatures up to 1200°C.
Patent
Composite compact having a base of a hard-centered alloy in which the base is joined to a substrate through a joint layer and process for producing the same
TL;DR: A composite compact component made of a composite compact consisting of a diamond or BN powder bonded to a hard sintered alloy base during a sintering operation is described in this article.
Patent
Composite compact components fabricated with high temperature brazing filler metal and method for making same
TL;DR: In this article, a component comprised of a composite compact, preferably diamond, and a substrate bonded to the compact is fabricated by heating the base layer, filler metal and substrate to a temperature in excess of degradation temperature while maintaining the temperature of the particulate layer below the degradation temperature via a heat sink.
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Thermally stable diamond compacts
TL;DR: A thermally stable diamond compact which has an alloy of liquidus above 700 DEG C bonded to a surface thereof is defined in this paper, where the alloy contains at least 40 percent by weight of silver or gold or a combination thereof and 1 to 10 percent of an active metal selected from the group of tungsten, titanium, zirconium, hafnium, vanadium, niobium, tantalum, chromium and molybdenum
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Thermally stable diamond abrasive compact body
TL;DR: In this article, a composite diamond abrasive compact comprising a thermally stable diamond compact directly bonded to a cemented carbide substrate is presented, and a method of producing the composite diamond compact under controlled elevated temperature and pressure conditions is also provided.