Patent
Manufacture of seal bonding material
Tomoyuki Furuyama,Yoshio Shinoda +1 more
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TLDR
In this paper, an Fe-Ni-Co type seal bonding alloy consisting of Ni 26W32wt% Ni, 15W19wt% Co and the balance Fe is cold worked and heat treated in a reducing atmosphere at 480W650°C for 25min or more to obtain a seal bonding material making striking as conventional preteratment for Ag plating unnecessary and extremely improving the adhesion of Ag-plating in a process of manufacturing seal bonding parts.Abstract:
PURPOSE: To cheaply obtain a seal bonding material making striking as conventional pretreatment for Ag plating unnecessary by cold working an Fe-Ni-Co type seal bonding alloy of a specified composition followed by heat treatment in a reducing atmosphere at a specified temp. for a specified time. CONSTITUTION: An Fe-Ni-Co type seal bonding alloy consisting of Ni 26W32wt% Ni, 15W19wt% Co and the balance Fe is cold worked and heat treated in a reducing atmosphere at 480W650°C for 25min or more to obtain a seal bonding material making striking as conventional preteratment for Ag plating unnecessary and extremely improving the adhesion of Ag plating in a process of manufacturing seal bonding parts. This material simplifies a plating process, considerably reduces the cost of manufacturing seal bonding parts, and is favorably uses as a seal bonding material for lead frames of a semiconductor integrated circuit device, etc. without producing a strain. COPYRIGHT: (C)1981,JPO&Japioread more
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