Metal-based composite material enhanced by three-dimensional networked diamond framework as well as preparation method

TLDR: In this article, a copper-based composite material enhanced by a three-dimensional networked diamond framework as well as a preparation method is presented. And the composite material can be used as electronic packaging and heat sink materials and the like and solves the problem about packaging electronic devices with high temperature, high frequency and high power.

Abstract: The invention provides a copper-based composite material enhanced by a three-dimensional networked diamond framework as well as a preparation method. The composite material comprises a metal base, the three-dimensional networked diamond framework and diamond particles, wherein the metal base is a common electronic packaging metal material such as Al, Cu, Ag and the like; the three-dimensional networked diamond framework adopts a substrate type or self-supporting type and is prepared by depositing diamond on the three-dimensional networked substrate which is machined and integrally formed or woven by one-dimensional wires; the three-dimensional networked diamond framework and the diamond particles all need surface modification treatment. According to the composite material, the three-dimensional networked diamond framework is distributed in the metal base, so that the composite material has excellent thermal conduction in the direction of the three-dimensional networked diamond framework, a series-parallel connection combined thermal conduction structure formed through addition of the diamond particles further improves the thermal conduction efficiency, and the composite material can be used as electronic packaging and heat sink materials and the like and solves the problem about packaging electronic devices with high temperature, high frequency and high power.