Patent
Method for manufacturing golden finger of soldering-pan of flexible package carrying board
Bing Chen,Ping Liu +1 more
TLDR
In this article, a method for manufacturing the golden finger of a soldering-pan of a flexible carrying board is described. But this method is not applicable to the case of a printed circuit carrying board.Abstract:
The invention relates to a method for manufacturing a flexible carrying board of which the chip is directly packaged on a flexible printed circuit carrying board (COF), in particular to a method for manufacturing a golden finger of a soldering-pan of a flexible carrying board. The COF packaged flexible carrying board is made of a glueless flexible substrate; a basement membrane of the substrate is made of a polyimide material and has the thickness between 12 and 25 micrometers; and a conductor layer is made of copper, and has the thickness between 9 and 36 micrometers. The method for manufacturing the golden finger of the soldering-pan of the flexible carrying board comprises low-stress electroless nickel plating & gold immersion technology; a raw material is nickel sulfate and a reducing agent is sodium hypophosphite; and in order to reduce the stress of a nickel layer, an additive for reducing the stress is added. The low-stress additive is one or more of benzene sulfonic acid sodium salt, coumarin, formaldehyde, aldehyde and naphthalene disulfonic acid, and the concentration is 0.01 to 0.2 mol/liter. The operating temperature of the low-stress electroless nickel plating is between 80 and 85 DEG C and the pH value is between 4.8 and 5.2.read more
Citations
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Patent
Method for electroless nickel-phosphorous alloy deposition onto flexible substrates
TL;DR: In this paper, a method for electroless deposition of a bendable nickel-phosphorous alloy layer onto flexible substrates such as flexible printed circuit boards and the like is described.
Patent
Flexible Base Substrate and Fabrication Method Thereof
Gao Tao,Mao Xue,Zhou Weifeng +2 more
TL;DR: In this paper, a flexible base substrate consisting of a first flexible film layer, having an upper surface and a lower surface opposite to each other, is presented, where a plurality of concave parts are arranged on the lower surface of the first flexible layer.
Patent
Multi-layer board flexible circuit board built-in golden finger exposure process
Yang Weixian,Ye Hua +1 more
TL;DR: In this paper, a multi-layer flexible circuit board with a built-in golden finger exposure process is presented, which comprises the steps of inner layer single side circuit production, upper outer layer copper foil inner layer gold finger etching and windowing, PI surface hot pressing glue pasting and lamination and positioning hole making, inner layer golden finger stamping and windowed, upper and lower layer alignment and hot pressing, positioning holes, numerical control drilling, plasma processing and smear removal, anti-plating tape pasting at a window, copper deposition and copper plating,
Patent
Multi-chip-embedded flexible printed circuit board and manufacturing method thereof
TL;DR: In this article, a multi-chip-embedded flexible printed circuit board and a manufacturing method are presented, where a double-face copper foil no-adhesive base material comprises a first copper foil and a second copper foil which are fixed mutually, and the circuit patterns on the first and second copper foils are connected through metalized micro-holes.
Patent
Method of configuring FPC (Flexible Printed Circuit) gold finger pressing pin
TL;DR: In this paper, a method for configuring a flexible printed circuit (FPC) gold finger pressing pin is presented. But the method is not suitable for the case of FPNs.
References
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Patent
Nickel cobalt phosphorous low stress electroplating
Darell Engelhaupt,B. Ramsey +1 more
TL;DR: An electrolytic plating process is provided for electrodepositing a nickel or nickel cobalt alloy which contains at least about 2% to 25% by atomic volume of phosphorous as mentioned in this paper.
Patent
Flexible printed circuit board structure
TL;DR: In this article, a flexible printing circuit board structure is proposed, where the utility model relates to a flexible printed circuit board, which comprises insulation base material, a silver plated circuit layer, copper plated layer, nickel plated and gold plated layers.