Patent
Method of bonding tab inner lead and bonding tool
Otsuka Yasuhiro,Hideki Kaneko +1 more
TLDR
In this article, a TAB tape was used to force the inner lead of the TAB tool to be pressed down into the inner-lead of the inner part of the tape, such that the bonding tool end and inner lead come in close contact with each other.Abstract:
A bonding tool (11a) having a round pointed end (16) smaller than the bonding pad (12) for the semiconductor element (15) is urged with a bonding force F₁ and pressed down into the inner lead (13) of a TAB tape such that the bonding tool end and inner lead come in close contact with each other. Then, the bonding force F₁ applied to the tool is reduced to F₂, while at the same time ultrasonic vibration (17) is applied to the tool, thus effecting bonding of the inner lead to the bonding pad with applied heat and pressure. Unlike the prior art, no bump has to be formed on the bonding pad for the semiconductor element or on an end of the inner lead. It is thus possible to simplify the bonding process and also to reduce the cost of bonding. Further, a highly reliable bond can be realized without causing crack or other damage to the pad structure.read more
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Patent
Semiconductor connection components and methods with releasable lead support
TL;DR: In this paper, a connection component for electrically connecting a semiconductor chip to a support substrate incorporates a preferably dielectric supporting structure defining gaps, and leads extend across these gaps so that the leads are supported on both sides of the gap.
Patent
Connection components with frangible leads and bus
Thomas H. DiStefano,Gary W. Grube,Igor Y. Khandros,Gaetan L. Mathieu,Jason Sweis,Laurie Union,David Gibson +6 more
TL;DR: In this article, an electrically conductive leads are adapted to be bonded to contacts on a semiconductor chip by breaking the frangible sections of the leads so as to disconnect the second ends of the leading from the bus and engage the leads with the contacts of the semiconductor.
Patent
Semiconductor inner lead bonding tool
TL;DR: In this paper, a tool for bonding inner leads to semiconductor chips is arranged to capture and align elongated lead sections extending in any one of plural directions, and preferably, in either one of two mutually orthogonal directions.
Patent
Methods of making semi-conductor connection components with releasable lead support
TL;DR: In this paper, a connection component for electrically connecting a semiconductor chip to a support substrate incorporates a preferably dielectric supporting structure defining gaps, and leads extend across these gaps so that the leads are supported on both sides of the gap.
Patent
Electrical Connector For A Window Pane Of A Vehicle
Timothy P. Hoepfner,Makoto Sato +1 more
TL;DR: In this article, a window pane has a substrate formed from glass and includes an electrical device including an electrical conductor, and an electrical connector is operatively connected to and in electrical communication with the conductor for transferring electrical energy to the conductor.
References
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Patent
Integrated test and assembly device
TL;DR: In this article, a semiconductor integrated circuit device of the beam lead type is presented, which is composed of an interconnection substrate with apertures for integrated circuit chips therein and with metallization patterns having sharply pointed ends for penetrating oxide layers over the bonding pads of the chips and for making electrical connection.
Patent
Microcircuit modular package
TL;DR: In this paper, the interconnection of integrated circuit chips is obtained by means of multilayers of microcircuit conductors fabricated on at least one flexible dielectric film.
Patent
Single point bonding method and apparatus
TL;DR: In this article, a single point bonding apparatus and method for bonding one electrical conductor to a second electrical conductor by a thermosonic process using force, time, temperature and ultrasonic energy as the key parameters in forming the bonds is presented.
Patent
Method and apparatus for the ultrasonic welding of thermoplastic films
TL;DR: In this article, a method of ultrasonically welding thermoplastic films, e.g. of polypropylene, is described. But it is not shown how to apply it to non-metallic sheet material.