Patent
Method of making a unitary polycrystalline diamond composite and diamond composite produced thereby
TLDR
In this article, a method of making unitary polycrystalline diamond composite by sintering a body of diamond particles at a temperature between about 1100*-3900*K and at a pressure ranging up to about 170 kilobars depending on the temperature.Abstract:
A method of making unitary polycrystalline diamond composite by sintering a body of diamond particles at a temperature between about 1100*-3900*K and at a pressure ranging up to about 170 kilobars depending on the temperature.read more
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Patent
Temperature resistant abrasive compact and method for making same
TL;DR: In this paper, a self-bonded abrasive body is formed by sintering a mass of abrasive particles under high temperatures and pressures (HP/HT) and then the body is treated to remove all infiltrated material.
Patent
Process for making diamond and cubic boron nitride compacts
TL;DR: In this article, the high pressure/high temperature (HP/HT) process for making diamond or CBN compacts has been modified by placing partitions within the crystal mass before HP/HT processing.
Patent
High thermal conductivity substrate
TL;DR: In this paper, a sintered diamond composite is made and the electrical properties of the composite are modified by leaching graphite and other non-diamond materials from the composite and subsequently infusing the leached composite with material having known electrical properties.
Patent
Ultrasharp diamond edges and points and method of making
TL;DR: In this article, the ultrasharp diamond edges and points which are usable as cutting instruments and as high intensity point sources for the emission of electrons, ions, x-rays, coherent and incoherent light and high frequency electromagnetic radiation are produced by preparing and classifying ultrafine diamond powder having a particle size of 10 to 100 angstroms.
Patent
Carbonaceous composite heat spreader and associated methods
TL;DR: In this article, a heat spreader can be incorporated into a cooling unit for transferring heat away from a heat source, which includes a heat sink with the heat spreaders disposed in thermal communication with both the heat sink and the heat source.
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