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Patent

Microelectronic variable inductor

TLDR
In this paper, the authors proposed a method for selectively open circuiting a portion of the cnductor by a laser beam which does not substantially heat the structure, with the heat which is produced being highly localized.
Abstract
A conductor provided on an insulating support has a portion which forms an inductor. Various components are connected to the conductor, as by soldering, to provide an electronic circuit suitable for a particular application. The conductor portion which forms the inductor has parallel branches and the value of the inductance can be changed by selectively open circuiting the branches. This can be accomplished after the components are connected and the complete circuit is tested to determine whether a change in the inductance value is required. The branches can be selectively open circuited by removing a portion of the cnductor by a laser beam which does not substantially heat the structure, with the heat which is produced being highly localized. Accordingly, this does not soften the solder connections of the components and there is no damaging effect on the circuit. The inductor portion as described can be connected in series with a coil, and the total inductance value of the coil and the conductor can be adjusted by cutting sections from the parallel branches to thereby provide the total inductance value required in a particular circuit application.

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Citations
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Patent

Method for fabricating an electronic device

TL;DR: In this article, a method of fabricating an electronic device on a carrier is described, where the method comprises forming a hole pattern in the carrier and providing a metallization pattern on the carrier, and through the holes (16, 22, etc.) to define the electronic device.
Patent

Printed circuit board inductor

TL;DR: In this paper, a multilayer printed circuit board (100) includes a plurality of layers (101, 102, 104, 106, 108, and 110) and an inductor (200) which is shielded by top layer ground plane (202) and bottom layer ground planes (204).
Patent

Broadband printed spiral

TL;DR: In this article, a thin film printed circuit inductive element exhibiting low Q was proposed, wherein a conductive spiral was deposited on an insulating substrate and resistive links were connected between adjacent turns of the spiral.
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Impedance matching network comprising selectable capacitance pads and selectable inductance strips or pads

TL;DR: In this paper, a customizable impedance matching network for coupling a microwave transmission line to an FET is proposed, which includes a plurality of conductive pads formed on the first surface of a dielectric substrate each pad providing in combination with the substrate and a conductor formed on an opposite surface of the substrate, a predetermined capacitance.
Patent

Miniaturized printed circuit and coil assembly

Ake Gustafson
TL;DR: In this article, the Flyer brings the wire for the winding, which causes the latter to pass over a metallized path of the printed circuit while keeping said wire taut.
References
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Patent

Thin-film resistors

TL;DR: In this paper, a resistive thin film is formed on a substrate by cathodic sputtering, reactive sputtering or vacuum evaporation, and the substrate may be of one of a number of metals, or compounds thereof.
Patent

Selectable fixed impedance device

TL;DR: In this paper, the authors propose an impedance device in which the impedance can be selected within a range of predetermined fixed values, which is comprised of an electrically insulating substrate on which is attached an impedance network, a plurality of electrically conductive terminations including at least two end terminations and a number of intermediate terminations which are electrically connected to the network at preselected locations.