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Proceedings ArticleDOI

New solutions for high frequency electronic packaging

W.P. Siebert
- Vol. 2, pp 954-957
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TLDR
In this article, an inexpensive doubled heat sink in extruded aluminum forms the base of the enclosure and the electronics are inserted into one part and is enclosed by a complementary shielding surface.
Abstract
A new concept for shielded enclosures of electronics is presented in this paper. An inexpensive doubled heat sink in extruded aluminum forms the base of the enclosure. The electronics are inserted into one part and is enclosed by a complementary shielding surface. The outer heat sink is cooled by forced ventilation. As openings are made redundant, seams between the parts of the enclosure are the only path for significant electromagnetic emissions. EMC-issues are also addressed in this paper; seams are modeled and simulated as short wave guides intercepted by screw joints. The simulations were carried out in CST Microwave Studio.

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Citations
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Alternative electronic packaging concepts for high frequency electronics

TL;DR: In this paper, the authors contribute to the adaptation of electronic packaging towards the needs of high frequency applications by using a high frequency application as a testbed for the use of the electronic packaging.
References
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Proceedings ArticleDOI

Investigation related to construction method and performance of an electromagnetic shielded enclosure

TL;DR: In this paper, a real-life scale model was created for measuring the electromagnetic shielding effectiveness with respect to simple processing methods for connection joints and to defects in the shield layer caused by bolt holes, nail holes, and other construction-related defects in metal foil and metal plate.
Proceedings ArticleDOI

Aluminum in the marine environment: an update

S. Freeman, +1 more
TL;DR: Aluminum is experiencing a resurgence in use in the marine environment as mentioned in this paper, and friction stir welding is likely to further accelerate this growth, which is the main reason for this resurgence.
Proceedings ArticleDOI

A comparison of air flow and shielding effectiveness of perforated enclosure panels

TL;DR: In this article, the shape and location of perforated enclosure panels are examined to examine how the shapes and locations of the perforations also impact the flow of cooling air.
Proceedings ArticleDOI

High quality shielding with predictable and verifiable effectiveness

G.G. Medveczky, +1 more
TL;DR: In this article, the authors present a comprehensive theoretical analysis of the shielding effectiveness of cavity resonators and antennas, including gasketing design and gasket evaluation; contact resistance and valid transfer impedance measurements; waveguides below their cut-off frequency; feed-through capacitors and filters; and novel, theoretically correct and unambiguous, definition of shielding effectiveness.
Proceedings ArticleDOI

Development of Chip-on-Dot flip chip technique utilizing Gold Dot/sup TM/ flexible circuitry

TL;DR: Chip-on-Dot as discussed by the authors is a flip chip assembly technique for assembling chips which does not mandate either under-bump metallization (UBM) treatment to the aluminum input/output pads or die bumping.