Thermosetting resin composition

TLDR: In this paper, the authors proposed a method to obtain a laminate having low permittivity and low dielectric loss tangent and improved in flexibility and impact resistance without detriment to its heat resistance and chemical resistance by mixing a specified cyanate ester resin with a specified hexafluoropropane compound.

Abstract: PURPOSE:To obtain the title composition which can give a laminate having low permittivity and low dielectric loss tangent and improved in flexibility and impact resistance without detriment to its heat resistance and chemical resistance by mixing a specified cyanate ester resin with a specified hexafluoropropane compound. CONSTITUTION:A thermosetting resin composition is obtained by mixing a cyanate ester resin of formula I (wherein A is an aromatic group or an aromatic ring-containing group; B is a 7-20C polycyclic alicyclic group; D is an active hydrogen-free substituent; p, q and r are each 0-3; their sum is 2 or greater, and s is 0-5) [e.g. XU-71787 of formula II (a product of Dow Chemical)] with a 2,2-bisaromatic substituted hexafluoropropane compound of formula III (wherein R1 and R2 are each H, OH, NH2, COOH, a group of formula IV, 1-3C alkyl or aromatic substituted phenoxy, and they cannot be H simultaneously) (e.g. a compound of formula V or VI). The obtained composition is one improved in flexibility and impact resistance without detriment to the low permittivity, low dielectric loss tangent, high heat resistance and chemical resisatnce of the resin of formula I and improved in the reliability of plating of through-hole formed by driling a laminate.