Showing papers on "Electroless nickel plating published in 1974"
Patent•
24 May 1974
TL;DR: In this article, a plated nickel plating bath containing an ester complex of polyhydric acid or alcohol such as the diboron ester of glucoheptonic acid is described.
Abstract: Electroless, polymetallic nickel alloys containing an element of boron or phosphorus and one or more metals selected from tin, tungsten, molybdenum or copper which have unique properties and are produced as a plated deposit in an electroless nickel plating bath containing an ester complex of polyhydric acid or alcohol such as the diboron ester of glucoheptonic acid.
22 citations
Patent•
23 Jan 1974
TL;DR: In this article, the authors describe the replenishment of aqueous electroless nickel plating solutions in essentially dry form in a manner that avoids triggering of the bath in order to prevent volume growth of the plating solution.
Abstract: This invention concerns replenishment of aqueous electroless nickel plating solutions and to apparatus useful therefor. The process of the invention comprises addition of replenishers in essentially dry form in a manner that avoids triggering of the bath. Typical replenishers that may be added in dry form include one or more of a soluble source of nickel ions such as nickel chloride, a reducing agent for nickel ions, bath stabilizers, brighteners, surfactants and the like. These ingredients may be added singularly or admixed with each other. Essentially dry materials are used for replenishment rather than a solution as in the prior art, to prevent volume growth of the plating solution.
16 citations