Showing papers on "Electroless nickel plating published in 1985"

Sliding surface of composite nickel-plated sliding member

Abstract: A composite nickel plated sliding surface is obtained by the formation of a composite nickel plating film on a sliding surface of an automobile part such as an engine cylinder or piston by electroless nickel plating. The plating film contains at least one member of wear resistant particles having an average particle size of 0.1 to 1.0μ selected from SiC, TiC, WC, BC4, TiN, Al2 O3 or the like, and also at least one member of lubricating particles having an average particle size of 1 to 10μ selected from BN, MoS2, and Teflon. The nickel plating bath is adjusted to have a phosphorus concentration of 0.5 to 12%. When the matrix of the nickel plating film has a phosphorus concentration of 0.5 to 5%, the film hardness is improved.

Electroless nickel plating solution

Abstract: PURPOSE:To obtain the titled plating soln having superior stability and a high rate of deposition by adding specified amount of copper ions to an electroless nickel plating soln contg a soluble nickel salt, a hypophosphite and a pH buffer as essential components CONSTITUTION:This plating soln having superior stability is obtd by adding 01-4ppm copper ions to an electroless nickel plating soln contg about 10-60g/l soluble nickel salt such as nickel sulfate, about 10-30g/l hypophosphite such as sodium hypophosphite and about 1-50g/l pH buffer such as acetic acid as essential components When plating is carried out with the resulting plating soln while the soln is kept at about 6-4 pH and about 50-30 degC, a thin nickel film can be uniformly formed on the surface of plastics or glass without requiring surface roughening

Silver plated composition and its manufacture

Abstract: PURPOSE:To obtain an inexpensive substitute for silver powder by successively plating a slurrified inorg. or org. core material with nickel and silver to form tough plating. CONSTITUTION:A slurrified inorg. or org. core material is plated in an electroless nickel plating soln. contg. alkali hypophosphite or alkali borohydride as a reducing agent. An electroless silver plating soln. made of an aqueous soln. contg. silver alkali cyanide, a reducing agent and alkali hydroxide is added to a slurry of the nickel plated core material to form silver plating. Thus, a silver plated composition having nickel plating contg. P or B on the inorg. or org. core material and silver plating on the nickel plating is obtd.

Stamper for molding optical disk and its manufacture

Abstract: PURPOSE: To form a stamper for molding an optical disk made of plastics which forms a conductive layer on an original board without depending upon a silver mirror reaction by providing an electrocast nickel layer on the electroless nickel plating layer CONSTITUTION: The stamper for molding the optical disk made of plastics is composed of a conductive layer formed by executing the electroless nickel plating onto the original board for electrocasting to have the irregular information of the submicron order and the track, and the electrocast nickel layer formed by electrocasting on the conductive layer The thickness of the conductive layer of the electroless nickel plating is generally 800W1,500Å and the thickness of the electrocast nickel layer is amount 300μm The electrocast nickel layer and the electroless nickel plating layer are mutually strongly linked, it is not necessary to remove the conductive layer after electrocasting, different from the conductive film of Ag due to the conventional silver mirror reaction, and the film can be used as the stamper for molding the plastics as it is COPYRIGHT: (C)1987,JPO&Japio

Preparation of amine boran

Abstract: PURPOSE:To obtain the titled compound useful as a reducing agent for electroless nickel plating in high yield, by reacting an amine salt with sodium boron hydride in a specific solvent, treating the reaction product simply after the reaction. CONSTITUTION:Diethylene glycol dimethyl ether or ethylene glycol diethyl ether is mixed with an amine salt, and reacted with sodium boron hydride or potassium boron hydride. After the reaction is over, a solvent is distilled away from the reaction product.

Preplate preparation for electroless nickel plating

Abstract: Guide pratique pour la preparation de plaques d'acier, d'acier inoxydable, de cuivre et d'aluminium

Surface treatment of aluminum alloy parts

Abstract: PURPOSE:To form an excellent rust preventive film having no surface defect by defatting and washing the surface of aluminum alloy parts then subjecting the parts to electroless nickel plating and further to a chromate treatment. CONSTITUTION:The surface of aluminum alloy parts is defatted and washed and thereafter said parts are subjected to electroless nickel plating, then to a chromate treatment. A nickel plating layer 3 is then selectively formed on the deposited particles 2 of the intermetallic compd., etc. of the alloy exposed on the surface of the aluminum base 1 of the parts and at the same time, the non- plated parts are generated. A chromate layer 4 is selectively formed in the non-plated parts by the succeeding chromate treatment, by which the protective film having excellent corrosion resistance is formed over the entire surface of the aluminum alloy parts. Said layer 3 and layer 4 are respectively as thin as about <=5mum and about <=1mum to give no adverse influence to the dimensional accuracy. Since the above-mentioned surface treatment is accomplished by dipping the parts in the treating liquid, the treatment of the parts having intricate surface shapes is also possible.

Dot wire for dot printer and its manufacturer

Abstract: PURPOSE:To obtain the titled dot wire light in weight and also having sufficient hardness on the surface thereof, by applying hard coat on the surface of a piano wire having 0.15-0.35mm diameter by electroless nickel plating. CONSTITUTION:The parent material made of a piano wire 3, which has the lower specific gravity as compared with the conventionally used refractory metal, tungsten and high speed steel, allows the printing to be conducted at higher speed. The application of low temperature heat treatment on the surface of the parent material after a hard coat 4 is applied thereon by electroless nickel plating, realizes the nickel plating coat having identical hardness to that of the conventionally used tungsten or high speed steel, thus, obtaining a dot wire for a dot printer having good abrasion resistance. In addition, the hard coat can be continuously applied on the fine long piano wire with simple process.

Electroless nickel plating method

Abstract: PURPOSE:To enable the uniform start of deposition and to increase the rate of deposition by adding a very small amount of copper ions to an electroless nickel plating soln CONSTITUTION:A surface to be plated is immersed in an electroless nickel plating soln contg nickel chloride, a hypophosphite and a pH buffer as essential components to form a nickel film on the surface In this electroless nickel plating method, 01-4ppm copper ions are allowed to always exist in the plating soln or a soln contg 01-4ppm copper ions is stuck to the surface to be plated before the surface is immersed in the plating soln

Surface treatment of heat transfer pipe of absorption type refrigerating machine

Abstract: PURPOSE:To protect heat transfer pipe from corrosion due to the contact with and stagnation of lithium bromide solution by a method wherein electroless nickel plating is applied onto the finned surface of copper heat transfer pipe. CONSTITUTION:A bath composition containing nickel salt such as nickel chloride or the like, reducing agent such as sodium hypophosphite or the like and buffering agent consisting of alkaline salts such as acetic acid or the like is used as the plating bath of electroless nickel plating method. The preferable plating conditions are normally bath pH 4-6, bath temperature 85-90 deg.C, process time 5- 10min. The minimum thickness of plating film developed to manifest corrosion- resisting effect is about 0.2mum and the preferable thickness is about 1.0-10mum. Only the immersion of copper heat transfer pipe into the predetermined plating bath containing nickel salt, reducing agent and buffering agent is enough for plating. Thus, the corrosion, which tends to develop at the lower part of fins due to the stagnation of lithium bromide solution serving as absorbent and to the deposit of corrosion product, can be surely prevented from developing.

Process development and scale-up of electroless nickel plating on molybdenum

Abstract: Procede de depot d'un revetement adherent d'alliage nickel-phosphore sur du molybdene, consistant en une attaque anodique dans une solution chronique acide nitrique, une attaque anodique dans un bain d'acide phosphorique et un stripping de l'oxyde dans une solution chromique acide nitrique. Pour extrapoler le procede de laboratoire il faut optimiser les parametres tels que le temps de pretraitement, la densite de courant, le rapport anode-cathode et la duree des arrets

Initiation of electroless nickel plating

Abstract: An aqueous initiator solution and process for rejuvenating such initiator solutions and for prolonging the useful operating life thereof by which copper and copper alloy substrates are treated therein to render them receptive to a subsequent electroless nickel plating step are disclosed. The detrimental effects of progressive contamination of such aqueous initiator solutions with metal ion complexing agents during commercial use and/or precipitation of the noble metal ions which progressively impairs the operativeness of such activator solutions is overcome by the addition of controlled amounts of ferric ions effective to maintain at least a sufficient portion of the noble metal ions in solution in a noncomplexed condition whereby the initiator solution is effective to pretreat the copper substrate prior to electroless nickel plating.

Powdery compounding agent for electroless nickel plating

Abstract: PURPOSE:To develop a powdery compounding agent for electroless Ni plating which is easy to carry and store and yields easily a desired concn. of electroless Ni plating liquid by heating nickel sulfate having deliquescence or nickel chloride and other additives respectively at specific temps. and mixing these materials in the form of powder. CONSTITUTION:NiSO4.6H2O and NiCl2.6H2O having deliquescence are respectively heated for >=30min at 110-270 deg.C and 64-270 deg.C to form the powder of NiSO4 and NiCl2 having no deliquescence. The powder contg. >=1 kind thereof as an Ni ion source is used and additives such as sodium hypophosphite, sodium acetate, malic acid, ammonium carbonate, sodium hydrogencarbonate, etc. heated for >=20min at 40-190 deg.C are used. The powder and additives are mixed respectively at prescribed ratios, by which the compounding agent for electroless Ni plating liquid is produced. The agent in the powder form has no deliquescence and is handled conveniently. A prescribed concn. of electroless Ni plating liquid is obtd. easily by adding water and dissolving said agent.