Showing papers on "Electroless nickel plating published in 1987"

Process for rejuvenation electroless nickel solution

Abstract: An aqueous initiator solution and process for rejuvenating such initiator solutions and for prolonging the useful operating life thereof by which copper and copper alloy substrates are treated therein to render them receptive to a subsequent electroless nickel plating step. The detrimental effects of progressive contamination of such aqueous initiator solutions with metal ion complexing agents during commercial use and/or precipitation of the noble metal ions which pregressively impairs the oprativeness of such activator solutions is overcome in accordance with the present invention by the addition of controlled amounts of ferric ions effective to maintain at least a sufficient portion of the noble metal ions in solution in a noncomplexed condition whereby the initiator solution is effective to pretreat the copper substrate prior to electroless nickel plating.

Electroless nickel plating on alumina ceramics

Abstract: Pour obtenir une bonne adherence du depot chimique de nickel sur des substrats en ceramique (96 a 99,5% d'alumine), on utilise comme traitements de preparation de la surface une attaque au fluorure d'ammonium suivie d'une sensibilisation au chlorure stanneux et d'une activation par du chlorure de palladium. Une composition appropriee et une purge du bain avec du gaz inerte ameliore l'adherence

Electroless Nickel Plating of Iron Powders

Abstract: This work illustrates the technical feasibility of the electroless nickel plating of iron powders. The coated powders exhibit a high level of homogeneity and the sintered compacts have good mechanical properties. Decreasing powder size increases the nickel concentration and improves diffusion by particle-to-particle contact. Alloying is promoted by reducing diffusion distances.

Base metal powder for ceramic capacitor electrode

Abstract: PURPOSE: To obtain low-cost base metal powder easy to be treated by plating the surfaces of first base metal powder as nuclei with a second base metal having a composition different from a first base metal through an electrolytic or electroless method. CONSTITUTION: The surfaces of first base metal powder having mean grain size of 0.1W20μm are plated with a second base metal having a composition different from first base metal powder through an electrolytic or electroless method. Cu or a Cu-Ni alloy is used as the first base metal. Ni is employed as the second base metal, and Ni is used through electroless nickel plating. The quantity of adhesion of Ni is increased exceedingly when the grain size of Cu powder extends over 0.1μm or less, a burning temperature as an electrode is displaced to a higher temperature, and the breaking of the electrode is generated. When the grain size of Cu powder exceeds 20μm, screen printing is made difficult while the continuity of the electrode after sintering is also deteriorated. Accordingly, base metal powder is not oxidized even through a degreasing process in air, and the title electrode sufficiently displays a function as an internal electrode on the main baking of a reducing atmosphere (such as nitrogen), thus acquiring a continuous electrode film. COPYRIGHT: (C)1989,JPO&Japio

Forming method for bump

Abstract: PURPOSE: To form bumps having high reliability at every semiconductor element by dipping semiconductor elements, to which aluminum electrodes are shaped, into a palladium solution, activating the surfaces of the electrodes and precipitating nickel on the electrodes through electroless nickel plating. CONSTITUTION: The surface of an Al electrode 12 for a semiconductor element, from which the greater part of the Al electrode 12 is exposed, is pretreated by the diluted solution of nitric acid (or phosphoric acid) and washed. The semiconductor element is dipped into a palladium activator consisting of palladium chloride, hydrochloric acid and water and the precitate 14 of Pd is attached to the surface of the exposed Al electrode 12. The Al electrode 12 is washed to an extent that the Pd precipitate on the surface of the Al electrode 12 for the semiconductor element is not removed, the semiconductor element is dipped into an electroless nickel plating bath and a nickel bump 15 is shaped to the periphery including the Al electrode 12 exposed, and electroless gold plating is executed. Accordingly, the bump having excellent adhesive properties can be formed without having an adverse effect on a substrate and the Al electrode for the element. COPYRIGHT: (C)1988,JPO&Japio

Mold for injection molding of synthetic resin

Abstract: PURPOSE: To enhance the corrosion resistance of a cooling water channel, to accurately control the temp. of a mold and to extend the life thereof, by forming an electroless nickel plating layer to the inner surface of the cooling water channel provided in the mold by drilling. CONSTITUTION: Cooling water channels 3 each having an elongated tunnel shape are appropriately provided in a fixed mold 1 and a movable mold 2 by drilling and cooling water is allowed to flow through said cooling water channels 3 to control the temp. of a mold to a predetermined constant value. An electroless nickel plating layer 4 is formed to the inner surface of each of the cooling water channels 3. Since the electroless nickel plating layer 4 is composed of a Ni-P alloy film having an amorphous structure, said layer 4 is excellent in corrosion resistance and generates almost no pinhole. When the injection molding of a synthetic resin is performed using the mold thus constituted, no rust is generated on the inner surface of each of the cooling water channels 3 in spite of long-term use and the flow of cooling water is not obstructed and heat conductivity is not lowered. As a result, the temp. of the mold is accurately held to a constant value and the life of the mold can be extended. COPYRIGHT: (C)1989,JPO&Japio

Manufacture of multilayer interconnection board

Abstract: PROBLEM TO BE SOLVED: To prevent the permeation of an electroless plating solution into the internal wall of a through hole by only coating the internal surface of the through hole with an electroless-plated nickel layer and forming a plating resist layer on the surface of a multilayered wiring board and, after roughening the surface of an adhesive layer, forming a conductor pattern with electroless-plated copper films including the inside of the through hole. SOLUTION: Protective layers 4 are formed on both surface of a multilayer interconnection board 19 by laminating adhesive films having acid and alkali resistances and through holes 5 are bored at necessary spots. After a catalyst for electroless plating 8 is applied to the entire surface of the board 19 including the internal surfaces of the through holes 5 and the protective layers 4 composed of the adhesive films are removed, nickel layers 6 are formed in the through holes 5 by dipping the board 19 in an electroless nickel plating solution and a plating resist layer 7 is formed on the surface of the board 19 after the surface is polished. Then the surface of an adhesive layer 3 is roughened by dipping the board 19 in a sulfuric acid-based chemical etchant and a plated copper layer 8 is formed on the internal surfaces of the holes 5 and the surface of the multilayer interconnection board 19 by dipping the board 19 in an electroless copper plating solution. The plated nickel player 6 prevents the erosion of the holes 5 by the chemical etchant.

Mold for the precision molding of glass articles

Abstract: Glass products such as glass lens elements are formed by an improved direct molding process at glass viscosities in the range of 10 8 - 10 12 poises. Selected moldable alkali aluminofluorophosphate optical glasses are pressed to an optical surface finish in air utilizing an optically smooth titanium nitride molding surface, the surface being provided, for example, as a surface coating on a stainless steel mold or on a nickel chromium alloy mold supporting an electroless nickel base coating. In a particular embodiment a nickel chromium alloy mold (1) which has been machined and which is the pressing surface is provided with a base coating (2) of an electroless nickel plating layer. This nickel layer supports a glass contact surface coating (3) consisting of plasma-deposited TiN.

Production of metallic mold for information signal recording carrier

Abstract: PURPOSE:To improve wear resistance by providing a hard film to a resist master disk recorded with information signals and integrally providing an electroless plating film and electrolytic plating film on the surface thereof, then stripping the part of the double-layered structure from the resist master disk. CONSTITUTION:The hard film 5 consisting of titanium nitride or titanium carbide is directly provided on the surface side formed with pits 3 of the resist master disk 4 recorded with the information signals as the pits 3 on the photoresist film 2 on a glass substrate 1 and is subjected to electroless nickel plating by which the electroless nickel plating film 6 is integrally provided on the hard film 5. Electrolytic plating added with sulfamic acid is thereafter executed to integrally provide the electrolytic nickel plating film 7. The part of a metallic mold 8 for an information signal recording carrier having the three-layered structure consisting of the electrolytic nickel plating film 7, the electroless nickel plating film 6 and the hard film 5 is stripped from the master disk 4 by which the metallic mold 8 for the information signal recording carrier is obtd. The metallic mold having the excellent wear resistance and durability is thus obtd.

Electroless nickel plating method for inorganic fine powder

Abstract: PURPOSE:To enable easy electroless plating on inorg. fine powder by sticking a silane coupling agent to the surface of the powder, sensitizing and activating the powder and carrying out electroless plating. CONSTITUTION:A water soluble silane coupling agent such as aluminosilane is stuck to the surface of inorg. fine powder such as fine Al2O3 powder or glass fibers and the powder is sensitized and activated. Electroless nickel plating is then carried out. By this method, uniform nickel plating causing no stripping can be stably formed on the surface of the inorg. fine powder.

Method for plating structural member of electrolytic cell

Abstract: PURPOSE:To simply and easily form nickel layers of a uniform thickness by electroless plating on the stainless steel parts of the structural members of an electrolytic cell even when the shapes of the parts are complex, by treating the parts with an acid to activate the surfaces and by carrying out direct electroless nickel plating. CONSTITUTION:The stainless steel parts of the structural members of an electrolytic cell such as the cathode chamber and the base material of the cathode are pretreated by degreasing and blasting. The pretreated parts are treated with an acid such as hydrochloric acid or oxalic acid at about 30-90 deg.C for about 10min-3hr to activate the surfaces. The activated surfaces are directly subjected to electroless nickel plating without carrying out striking or washing. The nickel plating is carried out at about 80-100 deg.C with a plating bath contg. a nickel salt such as nickel chloride, a reducing agent such as sodium hypophosphite, a complexing agent and a pH buffer or further contg. a dispersant such as TiO2. Nickel layers of about 5-200mum thickness are preferably formed by the nickel plating.

Electroless nickel plating on zinc die castings

Abstract: Description d'une nouvelle methode de revetement des pieces de zinc coulees sous pression: le nickelage chimique. Ce procede permet d'obtenir de bonnes caracteristiques pour les pieces traitees: resistance a l'usure et a la corrosion, adherence du revetement, durete, ... Comparaison avec les differentes methodes de plaquage couramment utilisees

Manufacture of insulating substrate with thin nickel layer

Abstract: PURPOSE:To manufacture an insulating plate with a metal layer without pinhole even if it is thin by forming a thin nickel layer on the uneven face of a metal foil support having the uneven face, laminating the thin layer with an insulating organic material to be integrated, and then selectively removing the support by etching. CONSTITUTION:A nickel layer formed by electroless nickel plating or the like on a metal foil support, such as a copper foil or the like having an uneven face is formed in a uniform thickness along the rough shape of the copper foil surface. Thus, after the copper foil formed with the nickel layer and resin are laminated, a thin nickel layer is transferred simultaneously with the uneven shape of the support to a substrate surface on which only the copper is removed by etching. The electroless plating provides less irregularity in the thickness of plating film according to the place, and scarcely generates a pinhole. Accordingly, the laminated plate with extrathin metal foil smaller than 5mum in thickness can be manufactured.

Electrolytic nickel-boron alloy plating bath

Abstract: PURPOSE:To obtain an electrolytic nickel-boron alloy plating bath which has a long bath life and high plating speed and yields a plating film having excellent heat resistance by adding secondary or ternary amine borane as a boron source to a nickel plating liquid. CONSTITUTION:The electrolytic nickel-boron alloy plating bath is obtd. by adding about 2g/l secondary or ternary amine borane having a reducibility as the boron source to the nickel plating bath. The above-mentioned nickel plating bath having the high plating speed and can be incorporated into the same plating line as other electrolytic plating lines. The above-mentioned plating bath is applicable to a watt bath, sulfamine bath of nickel plating bath based on said baths or a nickel plating bath of a complex salt type based on the electroless nickel plating bath. An org. compd. contg. divalent sulfur, iodine substd. org. compd. or a compd. of thallium salt, lead salt, etc. is added alone or in combination as a stabilizer at least at 0.1mg/l to the above-mentioned secondary or ternary amine borane to additionally improve the stability.

Manufacture of cap for optical device

Abstract: PURPOSE:To prevent the elution of a lead component from low-melting-point glass, by forming a plated layer on the metallized surface of the lowmelting- point glass and/or on the metallized surface of the low-meltingpoint glass in an electric metal plating process CONSTITUTION:A cap 1 and an insoluble electrode 7 are immersed in electric nickel plating liquid 9 in a tank 8 A positive voltage is applied to the electrode 7, and a negative voltage is applied to a metal shell 2 of the cap 1 An electric nickel plated layer 10 is formed on the metal surface of the cap 1, ie, on the surface of the metal shell 2, and on a plating ground layer 6 on the surface of high-melting-point glass 5 Then, the cap 1 is immersed in electroless nickel plating liquid 12 An electroless nickel plated layer 13 is formed on the electric nickel plated layer 10, which has been formed previously, to a desired thickness (about 5-7mum)

Formation of plated layer on conductor part formed on substrate

Abstract: PURPOSE:To improve the yield and reliability of production of wiring boards by forming an electrically conductive path between conductor parts formed on each substrate with electrically conductive paste, forming electroplated layers on the conductor parts and removing the path in an org. solvent under applied ultrasonic waves. CONSTITUTION:A ceramic substrate 3 is immersed in an alkali degreasing soln. to degrease the tungsten parts 1-1, 1-2 formed by metallization. The substrate 3 is washed and subjected to electroless nickel plating to form nickel layers 2-1. The substrate 3 is further washed and subjected to electroless gold plate to form gold layers 2-2. After the substrate 3 is washed again and dried with a dryer, an electrically conductive path 2-3 is formed between the resulting conductor parts with silver paste. A plating resist layer 2-4 is formed on the path 2-3 and then electroplated gold layers 2-5 are formed. Finally the substrate 3 is immersed in an org. solvent, and ultrasonic waves are applied to remove the path 2-3.

Electroless nickel plating method

Abstract: PURPOSE:To form a wear resistant film having fine luster by electroless plating at a high speed by using a body to be plated as the cathode in an electroless nickel plating bath and supplying a prescribed pulsating current so as to increase the catalytic activity on the cathode side. CONSTITUTION:The surface of a nonmetallic material is coated with a metallic film and the coated material is immersed in an electroless nickel plating bath contg. a nickel salt and a hypophosphite. The body to be plated is use as the cathode and a pulsating current having 0.1-100msec pulse length and suspension time is supplied at 0.1-3A/dm average current density to form an Ni-P alloy film on the surface of the body to be plated.

Ultra precision cutting of electroless nickel plating layer.

Abstract: This research is primarily aimed at the investigation of ultra precision cutting for the electroless nickel plating process. The electroless nickel plating process and subsequent heat treatment were adjust so that samples with three different phosphorus contents (5.5, 8.5 and 12.0 wt%); therefore, different microstructures and hardnesses were obtained. All samples were treated by the heat treatment conditions at 373, 473, 573 and 673K from 1to 3 hours. The conclusion drawn from this work is that electroless nickel plating for ultra precision cutting should contain at least an amorphous structure to obtain a high quality machined surface. Also, the nickel phosphorus plating material in heat treatment at 473K for 2hours is lightest damage for machined surface layer. The chip profile of ultra precision cutting appeared to have a lamellar structure for an amorphous structure

Outdoor exposure and accelerated tests of electroless nickel plating

Abstract: Resultats d'essais acceleres de corrosion avec simulation d'atmospheres exterieures (haute humidite, brouillard salin, SO 2 ) realises sur des aciers revetus de nickel par depot chimique. Influence du milieu et de la composition du depot (teneur en phosphore)

Method for plating polyamide

Abstract: PURPOSE:To enable plating giving superior adhesion, weather resistance and fine appearance by reinforcing a molded polyamide article with a heat resistant material, making the article electrically conductive and activating it with a nickel striking bath having a specified composition contg. citric acid. CONSTITUTION:A molded polyamide article is reinforced with a heat resistant material such as metallic powder or glass fibers and the surface of the article is coated and etched with a mixed soln. contg. chromic acid. The article is made electrically conductive by electroless nickel plating, and nickel striking is carried out as activation with a nickel striking bath contg. 150-350g/l citric acid and 50-150g/l nickel chloride. The article is then subjected to copper plating, nickel plating and finish plating with chromium or the like in succession. Thus, external parts for a watch having superior characteristics by the function of plating such as superior adhesion, corrosion and weather resistances and fine appearance are obtd.

Formation of glass optical element, mold therefor and manufacture of mold

Abstract: Glass products such as glass lens elements are formed by an improved direct molding process at glass viscosities in the range of 10 - 10 poises. Selected moldable alkali aluminofluorophosphate optical glasses are pressed to an optical surface finish in air utilizing an optically smooth titanium nitride molding surface, the surface being provided, for example, as a surface coating on a stainless steel mold or on a nickel chromium alloy mold supporting an electroless nickel base coating. In a particular embodiment a nickel chromium alloy mold (1) which has been machined and which is the pressing surface is provided with a base coating (2) of an electroless nickel plating layer. This nickel layer supports a glass contact surface coating (3) consisting of plasma-deposited TiN.