Showing papers on "Telecom infrastructure sharing published in 1986"
01 Oct 1986
TL;DR: In this paper, the authors present an overview of trends in related areas and correlate their effects on telecom power supplies, including IC evolution to lower working voltages and higher thermal densities; OEM power supply manufacturing trends; and the "global village" approach to telecom standards.
Abstract: The continuing pressures on size, increased features, standardization, and cost are driving telecom power supplies in several directions at once. This paper will describe some of these projected developments and the way that they will affect the power supply designs and configurations used in telecommunications products. The paper also will present an overview of trends in related areas and correlate their effects on telecom power supplies. Some related areas are telecom IC evolution to lower working voltages and higher thermal densities; OEM power supply manufacturing trends; and the "global village" approach to telecom standards.
5 citations