A catalyst solution includes a precious metal nanoparticle and a polymer having a carboxyl group and a nitrogen atom. The catalyst solution is useful for a catalyzing an electroless process for plating metal on non-conductive surfaces.

Plating catalyst and method

The invention relates to a method for arranging a metal palladium layer in a conducting layer of a printed circuit board and a layered structure thereof. The method comprises the following steps of: firstly, coating copper on an insulating substrate, and baking the substrate; then, sequentially carrying out the processes of drilling, copper precipitation, line manufacturing and insulating layer solder resisting so as to obtain a half-finished product of a board body; and finally, sequentially carrying out the processes of nickel precipitation, palladium precipitation and gold precipitation to the line part of the half-finished product of the board body. In the process of plating soft gold on the printed circuit board, a metal palladium layer is arranged between a nickel layer and a gold layer, so that the thickness of the gold layer can be greatly reduced so as to achieve the effect of lowering the material cost.

Method for arranging metal palladium layer in conducting layer of printed circuit board and layered structure thereof

The present invention has an object to provide an electroless gold plating solution capable of suppressing the corrosion of a substrate metal and realizing excellent wire bondability, and containing no hazardous substance. In order to achieve the object, as a reductive electroless gold plating solution used for formation of an electroless plated gold film on a surface of a plating target by electroless plating, an electroless plating solution containing a water-soluble gold compound, citric acid or a citrate salt, ethylenediaminetetraacetic acid or an ethylenediaminetetraacetate salt, hexamethylenetetramine, and a chain polyamine having an alkyl group having 3 or more carbon atoms and 3 or more amino groups is adopted.

Reductive electroless gold plating solution, and electroless gold plating method using the plating solution

The invention provides a manufacturing method of a substrate with fine metal patterns The method enables prevention of abnormal metal precipitation on the surface of a resin base when non-electrolyte nickel palladium gold plating processing is performed on the surface of fine metal patterns on a substrate such as the terminal part of a print circuit board Meanwhile, by the method, high-quality substrate with plating processing faces having fine metal patterns, print circuit boards and semiconductor devices can be obtained The manufacturing method of the substrate with fine metal patterns comprises the steps of embedding the lower part of a fine metal pattern in a trench equipped on a supporting surface of a substrate made of resin, performing non-electrolyte nickel palladium gold plating processing on the fine metal pattern part which is not in contact with the surface of the trench and making the ratio between the height X the plating area projects on the support surface and the minimum distance Y between patterns (X/Y)less than 08

Substrate with fine metal pattern, print circuit board and semiconductor device, and production method of substrate with fine metal pattern, print circuit board and semiconductor device

PROBLEM TO BE SOLVED: To improve reflectivity of light and to prevent discoloration of a silver-plated film under a high temperature condition.SOLUTION: An electroless plating method includes: a palladium treatment step of applying palladium treatment on a Ni-P plating film formed on an article to be plated; and an electroless silver plating step of applying an electroless silver plating to the article to be plated to which the palladium treatment is applied.

Electroless plating method and led mounting substrate

PROBLEM TO BE SOLVED: To provide a method of efficiently depositing an electroless gold-plating film of a plating film laminate on which an electroless nickel plating film, an electroless palladium plating film and an electroless gold-plating film are deposited. SOLUTION: A part of or the entire of an electroless gold-plating film of a plating film laminate on which an electroless nickel plating film, an electroless palladium plating film and an electroless gold-plating film are deposited, is formed by the electroless gold plating using an electroless gold plating bath containing a water-soluble gold compound, a complexing agent, a formaldehyde and/or formaldehyde bisulfite additive, and an amine compound expressed by a general formula R 1 -NH-C 2 H 4 -NH-R 2 or R 3 -(CH 2 -NH-C 2 H 4 -NH-CH 2 ) n -R 4 . In this method, two kinds of baths of a flash gold plating bath and a heavy-deposition gold plating bath need not be prepared. The gold-plated film of various kinds of thickness suitable for soldering or wire bonding can be deposited by one kind of gold plating bath. In particular, the electroless gold plating film of the thickness of ≥0.15 μm can be efficiently and effectively deposited in one process by using one kind of plating bath, the process can be simplified favorably in the cost aspect. COPYRIGHT: (C)2009,JPO&INPIT

阿弓大久保

Papers

Electroless gold-plating method and electronic component

阿弓 大久保

Papers

Electroless gold-plating method and electronic component

阿弓大久保