Abel Misrak

TL;DR: In this article, the performance of QFN package assembly under thermal and power cycle in combination and the stress distribution and plastic work for the package was evaluated under two different loads, i.e., power cycling and thermal cycling.

TL;DR: In this paper, the power cycling is done to check its solder ball reliability by estimating stresses and failure life cycles, and the mismatch in coefficient of thermal expansion (CTE) between components used in WLCSPs and the non-uniform temperature distribution makes the package deform resulting in thermal stresses.

TL;DR: In this article, the effect of immersion cooling on the mechanical properties of printed circuit board (PCB) and its impact on reliability of electronic packages was investigated, showing that Young's modulus is decreasing after immersion in dielectric coolant which is likely to increase reliability of electronics package.

TL;DR: In this paper, a real-world data center utilizing airside economization in an ANSI/ISA classified G2 environment was chosen for the study, where servers were removed and qualitative study of cumulative corrosion damage was carried out.

TL;DR: In this paper, the impact of filler content on the mechanical properties, sample preparation method for curable TIM materials with specified thicknesses, and impact of thermal aging on mechanical properties are studied using testing methods such as thermomechanical analyzer (TMA), dynamic mechanical analyzers (DMA), and Fourier infrared spectroscopy (FTIR).