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Abhishek Telang

Researcher at University of Cincinnati

Publications -  22
Citations -  926

Abhishek Telang is an academic researcher from University of Cincinnati. The author has contributed to research in topics: Residual stress & Peening. The author has an hindex of 13, co-authored 20 publications receiving 720 citations. Previous affiliations of Abhishek Telang include Visvesvaraya National Institute of Technology.

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Comparison of mechanisms of advanced mechanical surface treatments in nickel-based superalloy

TL;DR: In this article, the effects of three advanced mechanical surface enhancements treatments: laser shock peening, cavitation shotless peening and ultrasonic nano structure modification on residual stress, hardness, plastic deformation and changes in near surface microstructure introduced in a Ni-Base superalloy, IN718 SPF (Super plastic forming).
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Characteristics of surface layers formed on inconel 718 by laser shock peening with and without a protective coating

TL;DR: In this article, a recast layer formed in Inconel alloy 718 (IN718) as a result of laser shock peening without an ablative layer was characterized and compared with surface condition of a sample peened with a protective overlay.
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Effect of Ultrasonic Nanocrystal Surface Modification on residual stress, microstructure and fatigue behavior of ATI 718Plus alloy

TL;DR: In this paper, the authors investigated the use of ultrasonic nanocrystal surface modification (UNSM) to improve the fatigue life of ATI 718 Plus (718Plus), which led to nano-sized crystallites, twins, and high dislocation density in the near surface regions.
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Iterative thermomechanical processing of alloy 600 for improved resistance to corrosion and stress corrosion cracking

TL;DR: In this paper, the effects of TMP with iterative cycles of 10% cold work and strain annealing, on corrosion and stress corrosion cracking behavior of alloy 600 was studied, and the associated microstructural and cracking mechanisms were elucidated using transmission (TEM) and scanning electron microscopy (SEM), coupled with precession electron diffraction (PED) and electron back scatter diffraction mapping TMP resulted in increased fraction of low coincident site lattice (CSL) grain boundaries whilst decreasing the connectivity of random high angle grain boundaries.