A
Akira c
Researcher at Hitachi
Publications - 310
Citations - 2300
Akira c is an academic researcher from Hitachi. The author has contributed to research in topics: Signal & Layer (electronics). The author has an hindex of 26, co-authored 310 publications receiving 2300 citations. Previous affiliations of Akira c include Shin-Etsu Chemical.
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Patent
Treatment instrument for coronary artery bypass operation
Hirokuni Arai,Akira c,o Akita Sumitomo Bake Co. Ltd. Kawamata,Hideaki c,o Akita Sumitomo Bake Co. Ltd. Asai +4 more
TL;DR: A coronary artery bypass grafting device includes a plurality of attachment members each having: a flexible tube (102); a suction cup portion (101) provided in a tip end side of the flexible tube; a three-way cock (103) and a holding member (104) that holds the flexible tubes as discussed by the authors.
Patent
Start up of application on information processor by means of portable unit
Yasushi C,O Fujitsu Limited Hara,Isamu c,o Fujitsu Limited Yamada,Yoshiyasu c,o Fujitsu Limited Nakashima,Shigehiro c,o Fujitsu Limited Idani,Yoshihiro c,o Fujitsu Limited Matsuyama,Akira c,o Fujitsu Limited Shiba,Hiroshi c,Shinichi c,o Fujitsu Limited Shiotsu +14 more
TL;DR: In this paper, a portable information processing device consisting of a signal processing unit, a memory, a display unit, an input device and a wireless transceiver is used to activate an application associated with the piece of identification data.
Patent
Method of sealing a surface mount package type semiconductor device
Mitsuo c,o Fujitsu Limited Abe,Yoshitaka c,o Fujitsu Limited Aiba,Tetsuya c,o Fujitsu Limited Fujisawa,Toshio c,o Fujitsu Limited Hamano,Hiroshi c,o Fujitsu Limited Inoue,Yoshitsugu c,o Fujitsu Limited Katoh,Yoshihiro c,o Shinko Elec. Ind. Co. Ltd. Kubota,Akira c,o Fujitsu Limited Okada,Seiichi c,o Fujitsu Limited Orimo,Mitsutaka C,o Fujitsu Limited Sato,Masaaki c,o Fujitsu Limited Seki,Noriaki c,o Fujitsu Limited Shiba +23 more
TL;DR: In this article, a side surface holding portion for holding the side surfaces of the semiconductor chip is formed in the mold resin to restrict thermal deformation of the chip, which is matched with the thermal expansion coefficient of the printed circuit board.
Patent
Thermocouple protective tube
Gunma Complex Takuma Annaka-shi Kushihashi,Akira c,o Gunma Complex Akira Annaka-shi Satoh,Kazuhiro c,o Gunma Complex Kazuhiro Annaka-shi Yamaguchi +4 more
TL;DR: In this article, a thermocouple protection tube for protecting a wire is described, comprising a hollow cylinder-shaped body which has one end closed and is composed of pyrolytic boron nitride, and a coating layer which is formed on an outer surface of the cylindershaped body.
Patent
Coating liquid for forming silica-based film having low dielectric constant and substrate having film of low dielectric constant coated thereon
Akira c,Atsushi c,Michio c +2 more
TL;DR: In this article, a coating liquid for forming a silica-based film having a low dielectric constant, characterized in that it comprises (i) silicabased fine particles having phenyl groups and (ii) a polysiloxazane which can be produced by reacting an alkoxysilane represented by the formula (XnSi(OR1)4-n) and/or a hydrolyzate of a halogenated silane with a poly-silazane represented as formula (III), was presented.