High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.

Electrical connector system.

A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices

Case and rack system for liquid submersion cooling of electronic devices connected in an array

Experimental investigations on heat transfer and frictional characteristics of a turbulator roughened solar air heater duct

A system and a method for failover control comprising: maintaining a primary device table entry (DTE) in a first table activated for a first adapter in communication with a first processor node having a first root complex via a first switch assembly and maintaining a secondary DTE in standby for a second adapter in communication with a second processor node having a second root complex via a second switch assembly; maintaining a primary DTE in a second table activated for the second adapter and maintaining a secondary DTE in standby for the first adapter; and upon a failover, updating the secondary DTE in the first table as an active entry for the second adapter and forming a path to enable traffic to route from the second adapter through the second switch assembly over to the first switch assembly and up to the first root complex of the first processor node.

Switch failover control in a multiprocessor computer system

A sequential compression and temperature therapy blanket with a plurality of air chambers is disclosed. The air chambers are filled and released by a valve assembly that may be separate from or integrated within the blanket. The temperature therapy blanket includes a fluid bladder for delivering hot and/or cold therapy to a patient. The temperature therapy blanket may also include an air bladder for providing compression.

Compression sequenced thermal therapy system

An electrical interconnection system with high speed, differential electrical connectors. The connector is assembled from wafers containing columns of conductive elements, some of which form differential pairs. Each column may include ground conductors adjacent pairs of signal conductors. The ground conductors may be wider than the signal conductors, with ground conductors between adjacent pairs of signal conductors being wider than ground conductors positioned at an end of at least some of the columns. Each of the conductive elements may end in a mating contact portion positioned to engage a complementary contact element in a mating connector. The mating contact portions of the signal conductors in some of the pairs may be rotated relative to the columns. The printed circuit board to which the differential signal connector is mounted may be constructed with elongated antipads around pairs of signal conductors.

Electrical connector lead frame

An electronic system is disclosed that uses air for cooling first and second orthogonally oriented arrays of parallel circuit boards. Air is drawn into the front of the system, passes alongside the circuit boards in the first array, takes a 90-degree turn, continues over the circuit boards in the second array, and takes another 90-degree turn to exhaust through the rear of the system. The circuit boards in the first array are cooled through a separate airflow path, which preferably also runs front-to-rear.

Air cooling architecture for orthogonal board architectures

An electronic system includes an array of electronic assemblies at a first location within a system. An array of liquid cooling assemblies is placed at a second location within the system. Hoses or other liquid transport pathways connect the cooling assemblies to the electronic assemblies, for cooling the electronic assemblies. As more electronic assemblies are added to the system, additional cooling assemblies may be provided to manage the increased thermal demands.

Modular liquid cooling of electronic assemblies

A chiller assembly shaped for use in a standard electronics rack. The chiller has a low profile, and is capable of being made to occupy less than 5 rack units. The chiller is modular, with subassemblies positioned to allow easy removal for maintenance. The fan and power supply are made as replaceable subassemblies that can be inserted or removed from the front of the unit without any special tools. The pump is made with a magnetically coupled motor, allowing the motor to be easily removed for service or replacement. The motor is also accessible from the front panel of the assembly.

Modular rackmount chiller

A strip, leadframe or panel type handling device for use in testing semiconductor components. The handling device has a thermal plate assembly with embedded electrical resistance heaters. The heaters are separately controlled in zones to provide uniform temperature across the plate for elevated temperature testing. Cooling channels are formed in the plate. Intermingling channels are provided to allow different types of cooling fluids to be used to cool at different rates or hold a cold temperature at different levels. The cooling channels can likewise be provided in zones to promote temperature uniformity. Vacuum channels are used to hold the semiconductor parts under test in close contact with the thermal plate.

Andreas C. Pfahnl

Papers

Electrical connector lead frame

Air cooling architecture for orthogonal board architectures

Modular liquid cooling of electronic assemblies

Modular rackmount chiller

Semiconductor handler for rapid testing