Process gas discharged from a bypass pipe to a gas exhaust system can be prevented from diffusing back to the inside of a process chamber without having to install a dedicated vacuum pump at the downstream side of the bypass pipe. The substrate processing apparatus includes a process chamber accommodating a substrate, a gas supply system supplying process gas from a process gas source to the process chamber for processing the substrate, a gas exhaust system configured to exhaust the process chamber, two or more vacuum pumps installed in series at the gas exhaust system, and a bypass pipe connected between the gas supply system and the gas exhaust system. The most upstream one of the vacuum pumps is a mechanical booster pump, and the bypass pipe is connected between the mechanical booster pump and the rest vacuum pumps located at a downstream side of the mechanical booster pump.

Substrate Processing Apparatus

The present invention provides an apparatus for vacuum processing generally comprising an enclosure having a plurality of isolated chambers formed therein, a gas distribution assembly disposed in each processing chamber, a gas source connected to the plurality of isolated chambers, and a power supply connected to each gas distribution assembly.

Tandem process chamber

The invention provides an apparatus and method for performing a process on a substrate. At least two types of structures may be used to provide a flow path for a substrate so that the substrate may be moved from one processing or loading position to another. The first is a conveyor. The second is a track. The flow path may be a closed continuous loop. Each processing island has a valve for introduction and extraction of the substrate into and out of an interior of the island. The processing island may include load locks, and may include in conjunction therewith an inspection station, a CVD chamber, a PECVD chamber, a PVD chamber, a post-anneal chamber, a cleaning chamber, a descumming chamber, an etch chamber, or a combination of such chambers.

Modular substrate processing system

A wafer probing test machine including a loading/unloading section defined by a first frame to enclose plurality of cassette stages therein, a test section defined by a second frame for enclosing a test stage therein, an elevator for moving at least one of the cassette stages up and down, and a wafer transfer system having a multi-jointed arm for taking out the wafer from a cassette and transferring the wafer onto the test stage.

Wafer probing test machine

A system for facilitating wafer transfer comprises a susceptor unit (150) consisting of an inner susceptor section (152) which rests within an outer susceptor section (154). A vertically movable and rotatable support spider (120) located beneath the susceptor unit can rotate into positions to engage either the inner or the outer susceptor sections. When the inner section is engaged, for loading/unloading, the support spider lifts the inner section vertically out of the outer section. When the outer section is engaged, for processing, the support spider raises and lowers the entire unit. A robotic arm end effector (200) engages only the lower surface of the outer edge of the wafer (210), which overhangs from the inner section when supported by the inner section alone, thereby enabling transfer of the wafer back and forth between the robotic arm and the susceptor. Various species of end effectors are disclosed.

Substrate transfer system for semiconductor processing equipment

Apparatus for loading and unloading wafers including a support structure having associated with it a predetermined wafer engagement position at which wafers can be engaged by the processing machine, a temporary storage device mounted on the support structure for storing a wafer in position for pick up, the flat surfaces of the wafer being parallel to an X-axis and perpendicular to a Z-axis, a first wafer engagement member for carrying the wafer on the first engagement member between the temporary storage device and the engagement position, a first X-direction mover mounted on the support structure and operable to move the first engagement member parallel to the X-axis, a second wafer engagement member for carrying the wafer on the second engagement member between the temporary storage device and the engagement position, a second X-direction mover mounted on the support structure and operable to move the second engagement member parallel to the X-axis independent of the first engagement member, a Z-direction mover mounted on the support structure and operable to move the first and second engagement members in the Z-direction, and a controller to cause the first X-direction mover to move the first engagement member parallel to the X-axis toward the engagement position at the same time as or shortly after the second engagement member moves parallel to said X-axis away from the engagement position.

Apparatus and method for loading and unloading wafers

Pivoting a beam of light in one axis about a remote point by providing means for laterally translating the beam and a pivotal reflector and providing control means responsive to the pivotal position of the reflector to cause the means for laterally translating to translate the beam the amount necessary to cause the light beam from the reflector to be reflected to the remote point.

Antonios E. Prentakis

Papers

Apparatus and method for loading and unloading wafers

Light beam positioning apparatus

Vorrichtung und verfahren zur eingabe und entnahme von halbleiterscheiben

Light beam aligner

Method and apparatus for attaching and detaching wafer