AlGaN-based materials own direct transition energy bands and wide bandgap and thus can be used in high-efficiency ultraviolet (UV) emitters and detectors. Over the past two decades, AlGaN-based materials and devices experienced rapid development. Deep ultraviolet AlGaN-based light-emitting diodes (LEDs) with improved efficiency of 20.3% (at 275 nm) have been produced. An electron beam (EB)-pumped AlGaN-based UV light source at 238 nm, output power of 100 mW, and power conversion efficiency (PCE) of 40% has also been fabricated. UV stimulated emission from AlGaN multiple-quantum-wells laser diodes (LDs) using electrical pumping at room temperature has also been achieved at a wavelength of 336 nm. Compared with GaN-based blue and green LEDs and LDs, the efficiency of AlGaN-based UV LEDs and LDs is lower. Further optimization and improvements in both structure and fabrication are required to realize high-performance devices. In AlGaN-based UV photodetectors (PDs), gain as high as 104 orders of magnitude has been reported using the separated absorption and multiplication region avalanche photodiode structure but is still far from detecting the weak signal, and thus UV single-photon detectors with high detectivity is challenging. Recently, there has been extensive work in the nonlinear optical properties of AlGaN and AlGaN-based passive devices, such as waveguides and resonators. However, how to minimize the scattering and defect-related absorption needs to be further studied. In this review, first, approaches used to grow an AlGaN epilayer and p-type doping are introduced. Second, progress in AlGaN-based UV LEDs, EB-pumped light sources, LDs, PDs, passive devices, and the nonlinear optical properties are presented. Finally, an overview of potential future trends in AlGaN-based materials and UV devices is given.

AlGaN photonics: recent advances in materials and ultraviolet devices

III-Nitride nanowire optoelectronics

Materials for downconversion in solar cells: Perspectives and challenges

This paper reviews the progress of AlGaN-based deep-ultraviolet (DUV) light emitting diodes (LEDs), mainly focusing in the work of the authors’ group. The background to the development of the current device structure on sapphire is described and the reason for using a (0001) sapphire with a miscut angle of 1.0° relative to the m-axis is clarified. Our LEDs incorporate uneven quantum wells (QWs) grown on an AlN template with dense macrosteps. Due to the low threading dislocation density of AlGaN and AlN templates of about 5 × 108/cm2, the number of nonradiative recombination centers is decreased. In addition, the uneven QW show high external quantum efficiency (EQE) and wall-plug efficiency, which are considered to be boosted by the increased internal quantum efficiency (IQE) by enhancing carrier localization adjacent to macrosteps. The achieved LED performance is considered to be sufficient for practical applications. The advantage of the uneven QW is discussed in terms of the EQE and IQE. A DUV-LED die with an output of over 100 mW at 280–300 nm is considered feasible by applying techniques including the encapsulation. In addition, the fundamental achievements of various groups are reviewed for the future improvements of AlGaN-based DUV-LEDs. Finally, the applications of DUV-LEDs are described from an industrial viewpoint. The demonstrations of W/cm2-class irradiation modules are shown for UV curing.

A Review of AlGaN-Based Deep-Ultraviolet Light-Emitting Diodes on Sapphire

Electrode materials play a decisive role in almost all electrochemical energy storage devices, determining their overall performance. Proper selection, design and fabrication of electrode materials have thus been regarded as one of the most critical steps in achieving high electrochemical energy storage performance. As an advanced nanotechnology for thin films and surfaces with conformal interfacial features and well controllable deposition thickness, atomic layer deposition (ALD) has been successfully developed for deposition and surface modification of electrode materials, where there are considerable issues of interfacial and surface chemistry at atomic and nanometer scale. In addition, ALD has shown great potential in construction of novel nanostructured active materials that otherwise can be hardly obtained by other processing techniques, such as those solution-based processing and chemical vapor deposition (CVD) techniques. This review focuses on the recent development of ALD for the design and delivery of advanced electrode materials in electrochemical energy storage devices, where typical examples will be highlighted and analyzed, and the merits and challenges of ALD for applications in energy storage will also be discussed.

https://onlinelibrary.wiley.com/doi/pdf/10.1002/advs.201500405

Recent Development of Advanced Electrode Materials by Atomic Layer Deposition for Electrochemical Energy Storage.

Growing III-V semiconductor materials on Si substrates for opto-electronic applications is challenging because their high lattice mismatch and different thermal expansion coefficients cause the epitaxial layers to have low quality. Here we report the growth of a high-quality AlN template on a micro-circle-patterned Si substrate by using NH3 pulsed-flow multilayer AlN growth and epitaxial lateral overgrowth techniques. Then, we fabricated and characterized a deep-ultraviolet light-emitting diode (UV-LED) device using this AlN/patterned Si. By using standard lithography and inductively coupled plasma etching, the Si substrate was prepared with very high pattern density and was made deep enough to grow a thick AlN template with high crystal quality and very few threading dislocations, allowing for further re-growth of the deep UV-LED device. And by combining a transparent p-AlGaN contact layer, an electron blocking layer and using this high quality AlN template: a deep UV-LED device fabricated and showed a strong single sharp electroluminescence (EL) peak at 325 nm and achieved an external quantum efficiency (EQE) of about 0.03%, for a deep UV-LED grown on Si substrate.

Growth and Fabrication of High External Quantum Efficiency AlGaN-Based Deep Ultraviolet Light-Emitting Diode Grown on Pattern Si Substrate.

An AlN template layer is required for growth of AlGaN-based deep ultraviolet light-emitting diodes (UV-LEDs). However, the crystal quality of AlN templates grown on both flat and patterned Si substrates has so far been insufficient for replacing templates grown on sapphire substrates. In this work, we grew a high-quality AlN template on 2 in. micro-circle-patterned Si substrate (mPSiS) with two different sizes and shapes through controlling the bias power of inductively coupled plasma (ICP) etching. The experimental results showed that the best AlN template was obtained on a large pattern size with a bow-angle shape and the template had X-ray rocking curves with full widths at half-maximum of 620 and 1141 arcsec for the (002) and (102) reflection planes. The threading dislocation density near surface of AlN template through transmission electron microscopy (TEM) estimation was in the order of 107 cm−2, which is the lowest dislocation density reported for a Si substrate to our knowledge. A strong single electroluminescence (EL) peak was also obtained for an AlGaN-based deep UV-LED grown on this template, means that it can be used for further developing high-efficiency deep UV-LEDs.

/pdf/performance-improvement-of-aln-crystal-quality-grown-on-uzadpx2t3i.pdf

Performance Improvement of AlN Crystal Quality Grown on Patterned Si(111) Substrate for Deep UV-LED Applications.

https://ir.nctu.edu.tw:443/bitstream/11536/16462/1/000305100200033.pdf

Fabrication and characterization of n-In0.4Ga0.6N/p-Si solar cell

High-density micro-circle patterned Si substrates were successfully fabricated for the direct overgrowth of thick AlN templates by using NH3 pulsed-flow multilayer AlN growth and epitaxial lateral overgrowth techniques. The experimental results show that an 8-μm-thick AlN template was grown at a very high growth rate on the substrates. The AlN template had full widths at half maximum of 0.23° and 0.37° for the (002) and (102) reflection planes in X-ray diffraction rocking curves. Atomic force microscopy and transmission electron microscopy confirmed that the roughness of the surface was low (3.5 nm) and the dislocation density was very low (1.5 × 108 cm−2 (screw), 3.7 × 108 (edge) cm−2).

/pdf/direct-growth-and-controlled-coalescence-of-thick-aln-5fk16v30hl.pdf

Direct Growth and Controlled Coalescence of Thick AlN Template on Micro-circle Patterned Si Substrate.

The reduction of native oxides on an InAs surface using various wet and dry chemical treatments, including hydrochloric acid (HCl) treatment, sulfide treatment, and in situ trimethyl aluminum (TMA) treatment before the atomic layer deposition (ALD) of Al2O3 on InAs is studied. X-ray photoelectron spectrum (XPS) results show that the effect of surface cleaning by TMA was apparent almost after the first pulse but that TMA cleaning is not as effective as wet chemical surface cleaning. The combination of wet chemical treatment and TMA pretreatment is the most effective method for InAs surface cleaning, as indicated by the XPS analysis. Capacitance–voltage (C–V) and current density–voltage (J–V) characteristics on metal–oxide–semiconductor capacitance (MOSCAP) structures were also investigated to evaluate the Al2O3/n-InAs interface quality after different surface treatments, and the results are consistent with the XPS analysis.

https://iopscience.iop.org/article/10.1143/JJAP.49.111201/pdf

Binh Tinh Tran

Papers

Growth and Fabrication of High External Quantum Efficiency AlGaN-Based Deep Ultraviolet Light-Emitting Diode Grown on Pattern Si Substrate.

Performance Improvement of AlN Crystal Quality Grown on Patterned Si(111) Substrate for Deep UV-LED Applications.

Fabrication and characterization of n-In0.4Ga0.6N/p-Si solar cell

Direct Growth and Controlled Coalescence of Thick AlN Template on Micro-circle Patterned Si Substrate.

Effects of Wet Chemical and Trimethyl Aluminum Treatments on the Interface Properties in Atomic Layer Deposition of Al2O3 on InAs