Heat and fluid flow in high-power LED packaging and applications

Thermal effects in packaging high power light emitting diode arrays

Review of applications and developments of ultra-thin micro heat pipes for electronic cooling

Thermal management systems for Photovoltaics (PV) installations: A critical review

Silicon-Carbide (SiC) devices with superior performance over traditional silicon power devices have become the prime candidates for future high-performance power electronics energy conversion. Traditional device packaging becomes a limiting factor in fully realizing the benefits offered by SiC power devices, and thus, improved and advanced packaging structures are required to bridge the gap between SiC devices and their applications. This paper provides a review of the state-of-art advanced module packaging technologies for SiC devices with the focuses on module layout, packaging material system, and module integration trend, and links these packaging advancements to their impacts on the SiC device performances. Through this review, the paper discusses main challenges and potential solutions for SiC modules, which is critical for future SiC applications.

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A review of SiC power module packaging: Layout, material system and integration

A new technique for the packaging of IGBT modules has been developed. The components are sandwiched between two direct bond copper (DBC) substrates with aluminum nitride. Wire bonds are replaced with flip chip solder bumps, which allows cooling of components on both sides. Microchannel heat sinks are directly integrated in the package to decrease the thermal resistance of the module. Thus, a very compact module with high thermal performance is obtained. A prototype with two insulated gate bipolar transistors (IGBTs) and four diodes associated in parallel was realized and tested. In this paper, the innovative packaging technique is described, and results of thermal tests are presented.

Double-sided cooling for high power IGBT modules using flip chip technology

An increase in power densities in electronic devices is a direct consequence of their miniaturization and performance improvements. We propose the use of flat miniature heat pipes with micro capillary grooves to spread heat flux across a heat sink. Models of the structure were developed to calculate heat transfer limitations and temperature drops. A brass/water prototype was fabricated to demonstrate the feasibility of heat spreading using this type of heat pipe. Simulation and experimental results obtained with the prototype are described. The dissipated power reached 110 W/cm/sup 2/ without heat transfer limitations. The results are then extended to the design of this type of heat pipe in silicon. Thermal performance was calculated. Simulation, experimental results and the fabrication process are presented.

Silicon heat pipes used as thermal spreaders

The miniaturization and improving performance of electronic devices has lead to increasing power densities in electronic systems. Consequently, the thermal environment has become a main issue in their performance and reliability. The use of flat miniature heat pipes has been investigated for transferring the heat over distances or to spread it over a larger surface area to avoid hot spots on the device. The interest of silicon etching techniques for heat pipe manufacturing is that such heat pipes can be very compact, very light and have better heat transfer capacities than metallic heat pipes. In this paper the structure of a flat radial structure silicon heat pipe is presented. A one dimensional two-phase flow model has been developed in order to optimize the performances of the radial grooved silicon heat pipe. Then an experimental study investigates the thermal performance of a realized prototype. The thermal transfer capacities achieved are in the range 50-70 W depending on the working temperature

Design, fabrication and test of silicon heat pipes with radial microcapillary grooves

Power devices such as IGBTs dissipate very large heat flux densities. Therefore the thermal environment is a main issue in their performance and reliability. In order to improve heat transfer, materials with high thermal conductivity seem to be very useful. Because of their high cost, we suggest replacing them with a groove wick and sintered metal powder wick heat pipes. Thermal simulations are provided to show the interest of these structures in power electronics. Heat spreaders composed of heat pipe or plain material are compared. A 40% decrease of the thermal resistance between the heat source and the ambient is expected. Then an experimental study on a brass-water heat pipe is described. Results are compared with thermal simulations.

On the use of flat heat pipes as thermal spreaders in power electronics cooling

An increase in power densities in electronic devices is a direct consequence of their miniaturization and performance improvements. We propose the use of flat miniature heat pipes with micro capillary grooves to spread heat flux across a beat sink. Models of the structure were developed to calculate heat transfer limitations and temperature drops. A brass/water prototype was fabricated to demonstrate the feasibility of heat spreading using this type of heat pipe. Simulation and experimental results obtained with the prototype are described. The dissipated power reached 110 W/cm/sup 2/ without heat transfer limitations. The results are then extended to the design of this type of heat pipe in silicon. Thermal performance was calculated. Simulation, experimental results and the fabrication process are presented.

C. Gillot

Papers

Double-sided cooling for high power IGBT modules using flip chip technology

Silicon heat pipes used as thermal spreaders

Design, fabrication and test of silicon heat pipes with radial microcapillary grooves

On the use of flat heat pipes as thermal spreaders in power electronics cooling

Silicon heat pipes used as thermal spreaders