L
L. Meysenc
Researcher at Alstom
Publications - 1
Citations - 126
L. Meysenc is an academic researcher from Alstom. The author has contributed to research in topics: Thermal copper pillar bump & Thermal resistance. The author has an hindex of 1, co-authored 1 publications receiving 113 citations.
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Double-sided cooling for high power IGBT modules using flip chip technology
TL;DR: In this paper, a new technique for the packaging of IGBT modules has been developed, where the components are sandwiched between two direct bond copper (DBC) substrates with aluminum nitride.