C
C. Goldberg
Researcher at Motorola
Publications - 1
Citations - 105
C. Goldberg is an academic researcher from Motorola. The author has contributed to research in topics: Die (integrated circuit) & Integrated circuit packaging. The author has an hindex of 1, co-authored 1 publications receiving 99 citations.
Papers
More filters
Journal ArticleDOI
Impact of flip-chip packaging on copper/low-k structures
TL;DR: In this paper, the impact of thin film residual stresses has been studied at both wafer level and package level for flip-chip die attach process, and two solutions have been suggested to prevent catastrophic delamination in copper/low-k flipchip packages, improving adhesion strength of low-k/barrier interface or adding tiles and slots in low k structures to reduce possible area for crack growth.