The outstanding properties of SiO2, which include high resistivity, excellent dielectric strength, a large band gap, a high melting point, and a native, low defect density interface with Si, are in large part responsible for enabling the microelectronics revolution. The Si/SiO2 interface, which forms the heart of the modern metal–oxide–semiconductor field effect transistor, the building block of the integrated circuit, is arguably the worlds most economically and technologically important materials interface. This article summarizes recent progress and current scientific understanding of ultrathin (<4 nm) SiO2 and Si–O–N (silicon oxynitride) gate dielectrics on Si based devices. We will emphasize an understanding of the limits of these gate dielectrics, i.e., how their continuously shrinking thickness, dictated by integrated circuit device scaling, results in physical and electrical property changes that impose limits on their usefulness. We observe, in conclusion, that although Si microelectronic devices...

Ultrathin (<4 nm) SiO2 and Si-O-N gate dielectric layers for silicon microelectronics: Understanding the processing, structure, and physical and electrical limits

Disorder and long-range interactions are two of the key components that make material failure an interesting playfield for the application of statistical mechanics. The cornerstone in this respect has been lattice models of the fracture in which a network of elastic beams, bonds, or electrical fuses with random failure thresholds are subject to an increasing external load. These models describe on a qualitative level the failure processes of real, brittle, or quasi-brittle materials. This has been particularly important in solving the classical engineering problems of material strength: the size dependence of maximum stress and its sample-to-sample statistical fluctuations. At the same time, lattice models pose many new fundamental questions in statistical physics, such as the relation between fracture and phase transitions. Experimental results point out to the existence of an intriguing crackling noise in the acoustic emission and of self-affine fractals in the crack surface morphology. Recent advances ...

Statistical models of fracture

http://li.mit.edu/Archive/Papers/10/Wang10.pdf

Phase field modeling of defects and deformation

The development of new glassy materials is key for addressing major global challenges in energy, medicine, and advanced communications systems. For example, thin, flexible, and large-area glass substrates will play an enabling role in the development of flexible displays, roll-to-roll processing of solar cells, next-generation touch-screen devices, and encapsulation of organic semiconductors. The main drawback of glass and its limitation for these applications is its brittle fracture behavior, especially in the presence of surface flaws, which can significantly reduce the practical strength of a glass product. Hence, the design of new ultrastrong glassy materials and strengthening techniques is of crucial importance. The main issues regarding glass strength are discussed, with an emphasis on the underlying microscopic mechanisms that are responsible for mechanical properties. The relationship among elastic properties and fracture behavior is also addressed, focusing on both oxide and metallic glasses. From a theoretical perspective, atomistic modeling of mechanical properties of glassy materials is considered. The topological origin of these properties is also discussed, including its relation to structural and chemical heterogeneities. Finally, comments are given on several toughening strategies for increasing the damage resistance of glass products.

Towards Ultrastrong Glasses

https://hal.archives-ouvertes.fr/hal-02132509/document

2D and 3D Abaqus implementation of a robust staggered phase-field solution for modeling brittle fracture

We report in situ atomic force microscopy experiments which reveal the presence of nanoscale damage cavities ahead of a stress-corrosion crack tip in glass. Their presence might explain the departure from linear elasticity observed in the vicinity of a crack tip in glass. Such a ductile fracture mechanism, widely observed in the case of metallic materials at the micrometer scale, might be also at the origin of the striking similarity of the morphologies of fracture surfaces of glass and metallic alloys at different length scales.

http://www.gm.univ-montp2.fr/spip/IMG/pdf/PRL_2003_90_075504.pdf

Glass breaks like metal, but at the nanometer scale.

We investigate the scaling properties of postmortem fracture surfaces in silica glass and glassy ceramics. In both cases, the 2D height-height correlation function is found to obey Family-Viseck scaling properties, but with two sets of critical exponents, in particular, a roughness exponent $\ensuremath{\zeta}\ensuremath{\simeq}0.75$ in homogeneous glass and $\ensuremath{\zeta}\ensuremath{\simeq}0.4$ in glassy ceramics. The ranges of length scales over which these two scalings are observed are shown to be below and above the size of the process zone, respectively. A model derived from linear elastic fracture mechanics in the quasistatic approximation succeeds to reproduce the scaling exponents observed in glassy ceramics. The critical exponents observed in homogeneous glass are conjectured to reflect the damage screening occurring for length scales below the size of the process zone.

https://hal.archives-ouvertes.fr/hal-00089020/document

Scaling exponents for fracture surfaces in homogeneous glass and glassy ceramics.

The scaling properties of post-mortem fracture surfaces of brittle (silica glass), ductile (aluminum alloy) and quasi-brittle (mortar and wood) materials have been investigated. These surfaces, studied far from the initiation, were shown to be self-affine. However, the Hurst exponent measured along the crack direction is found to be different from the one measured along the propagation direction. More generally, a complete description of the scaling properties of these surfaces call for the use of the two-dimensional (2D) height–height correlation function that involves three exponents ζ ≃ 0.75, β ≃ 0.6 and z ≃1.25 independent of the material considered as well as of the crack growth velocity. These exponents are shown to correspond to the roughness, growth and dynamic exponents respectively, as introduced in interface growth models. They are conjectured to be universal.

/pdf/anisotropic-self-affine-properties-of-experimental-fracture-45sg6nwj3a.pdf

Anisotropic self-affine properties of experimental fracture surfaces

Nano-ductile crack propagation in glasses under stress corrosion: spatiotemporal evolution of damage in the vicinity of the crack tip

We report here atomic force microscopy experiments designed to uncover the nature of failure mechanisms occuring within the process zone at the tip of a crack propagating into a silica glass specimen under stress corrosion. The crack propagates through the growth and coalescence of nanoscale damage spots. This cavitation process is shown to be the key mechanism responsible for damage spreading within the process zone. The possible origin of the nucleation of cavities, as well as the implications on the selection of both the cavity size at coalescence and the process zone extension are finally discussed.

/pdf/nanoscale-damage-during-fracture-in-silica-glass-2e332hjzhe.pdf

C. Guillot

Papers

Glass breaks like metal, but at the nanometer scale.

Scaling exponents for fracture surfaces in homogeneous glass and glassy ceramics.

Anisotropic self-affine properties of experimental fracture surfaces

Nano-ductile crack propagation in glasses under stress corrosion: spatiotemporal evolution of damage in the vicinity of the crack tip

Nanoscale damage during fracture in silica glass