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Chakravarthy Balaji

Researcher at Indian Institute of Technology Madras

Publications -  215
Citations -  4651

Chakravarthy Balaji is an academic researcher from Indian Institute of Technology Madras. The author has contributed to research in topics: Heat transfer & Nusselt number. The author has an hindex of 34, co-authored 203 publications receiving 3732 citations. Previous affiliations of Chakravarthy Balaji include Indian Institutes of Technology & Hamburg University of Technology.

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Experimental investigations on phase change material based finned heat sinks for electronic equipment cooling

TL;DR: In this article, the phase change material (PCM) used in this study is n-eicosane and is placed inside a heat sink made of aluminium, which acts as thermal conductivity enhancer.
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Thermal optimization of PCM based pin fin heat sinks: An experimental study

TL;DR: In this paper, an experimental investigation carried out to characterize the thermal performance of different configurations of phase change material (PCM) based pin fin heat sinks was carried out and the results showed that there exists sufficient scope to optimize the thermal design of the heat sink.
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Method to improve geometry for heat transfer enhancement in PCM composite heat sinks

TL;DR: In this article, a thermal design procedure for proper sizing of composite heat sinks, for maximizing the energy storage and the time of operation until all of the latent heat storage is exhausted, is presented.
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Interaction of surface radiation with free convection in a square cavity

TL;DR: In this paper, a numerical investigation of free convection in a rectangular enclosure has been carried out based on Gosman's finite volume method with a 21 × 21 non-uniform grid, and a radiation model has been included in the analysis to study the effect of surface radiation on the heat transfer characteristics of the enclosure.
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Experimental investigations on thermal performance enhancement and effect of orientation on porous matrix filled PCM based heat sink

TL;DR: In this paper, the effect of orientation of the heat sink on thermal performance is studied by developing a tracking system, capable of placing a heat sink at any specified orientation, which is used to mimic the heat generation in electronic chips.